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1. WO2019042015 - FILM LAYER STRUCTURE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING FILM LAYER STRUCTURE

Publication Number WO/2019/042015
Publication Date 07.03.2019
International Application No. PCT/CN2018/094880
International Filing Date 06.07.2018
IPC
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
CPC
H01L 2251/5338
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2251Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
50Organic light emitting devices
53Structure
5338Flexible OLED
H01L 27/3246
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3246Pixel defining structures, e.g. banks
H01L 27/3258
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3258Insulating layers formed between TFT elements and OLED elements
H01L 51/0097
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0096Substrates
0097flexible substrates
H01L 51/5246
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
524Sealing arrangements having a self-supporting structure, e.g. containers
5246characterised by the peripheral sealing arrangements, e.g. adhesives, sealants
H01L 51/5253
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
5253Protective coatings
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
  • 合肥鑫晟光电科技有限公司 HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 王玉林 WANG, Yulin
  • 施槐庭 SHIH, Huai Ting
  • 宋丽芳 SONG, Lifang
  • 彭锐 PENG, Rui
Agents
  • 北京市中咨律师事务所 ZHONGZI LAW OFFICE
Priority Data
201710751104.X28.08.2017CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FILM LAYER STRUCTURE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING FILM LAYER STRUCTURE
(FR) STRUCTURE DE COUCHE DE FILM, DISPOSITIF D'AFFICHAGE ET PROCÉDÉ PERMETTANT DE FABRIQUER UNE STRUCTURE DE COUCHE DE FILM
(ZH) 一种膜层结构、显示装置及膜层结构的制备方法
Abstract
(EN)
The present application relates to the technical field of display, and provides a film layer structure, a display device, and a method for manufacturing a film layer structure. According to the present application, a first organic film layer having sloped edges is provided on a substrate, and an angle between a tangent of the upper surface of each sloped edge and the substrate is less than a breakable angle, which refers to a angle at which a first additional film layer formed on the sloped edge of the first organic layer is broken or tends to be broken.
(FR)
La présente invention se rapporte au domaine technique de l'affichage et concerne une structure de couche de film, un dispositif d'affichage et un procédé permettant de fabriquer une structure de couche de film. Selon la présente invention, une première couche de film organique ayant des bords inclinés est disposée sur un substrat, et un angle entre une tangente de la surface supérieure de chaque bord incliné et le substrat est inférieur à un angle de rupture, qui fait référence à un angle auquel une première couche de film supplémentaire formée sur le bord incliné de la première couche organique se rompt ou tend à se rompre.
(ZH)
本公开文本提供了一种膜层结构、显示装置及膜层结构的制备方法,涉及显示技术领域。本公开文本通过在基板上设置具有斜坡状边缘的第一有机膜层,且所述斜坡状边缘的上表面的切线与所述基板之间的夹角小于易破裂角度,所述易破裂角度是指在第一有机层的斜坡状边缘上形成的第一附加膜层发生破裂或倾向于发生破裂的角度
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Latest bibliographic data on file with the International Bureau