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1. (WO2019041942) OPPOSING SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL, AND PACKAGING METHOD
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Pub. No.: WO/2019/041942 International Application No.: PCT/CN2018/090123
Publication Date: 07.03.2019 International Filing Date: 06.06.2018
IPC:
H01L 51/52 (2006.01) ,H01L 51/56 (2006.01) ,H01L 27/32 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
Applicants:
京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO. , LTD. [CN/CN]; 中国北京市 朝阳区酒仙桥路10号 No.10 Jiuxianqiao Rd. , Chaoyang District Beijing 100015, CN
Inventors:
罗程远 LUO, Chengyuan; CN
Agent:
北京律智知识产权代理有限公司 BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD.; 中国北京市 朝阳区慧忠路5号B1605、B1606、B1607 B1605, B1606, B1607, No. 5 Huizhong Road Chaoyang District Beijing 100101, CN
Priority Data:
201710776007.631.08.2017CN
Title (EN) OPPOSING SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL, AND PACKAGING METHOD
(FR) SUBSTRAT OPPOSÉ ET SON PROCÉDÉ DE FABRICATION, PANNEAU D’AFFICHAGE, ET PROCÉDÉ D'ENCAPSULATION
(ZH) 一种对置基板及其制备方法、显示面板以及封装方法
Abstract:
(EN) An opposing substrate and a manufacturing method thereof, a display panel and a packaging method, comprising: a substrate (1); spaced columns (2) arranged in an array on the substrate (1); an auxiliary electrode layer (3) covering both the spaced columns (2) and the substrate (1); and a lubricating layer (4) covering at least the auxiliary electrode layer (3) corresponding to the spaced columns (2), thereby resolving an issue in which an auxiliary electrode layer is unable to make contract with a top electrode when an existing opposing substrate and an array substrate are pressed together.
(FR) La présente invention porte sur un substrat opposé et son procédé de fabrication, sur un panneau d'affichage et sur un procédé d'encapsulation, comprenant : un substrat (1) ; des colonnes espacées (2) agencées en un réseau sur le substrat (1) ; une couche d'électrode auxiliaire (3) recouvrant à la fois les colonnes espacées (2) et le substrat (1) ; et une couche lubrifiante (4) recouvrant au moins la couche d'électrode auxiliaire (3) correspondant aux colonnes espacées (2), ce qui permet de résoudre le problème selon lequel une couche d'électrode auxiliaire ne peut pas entrer en contact avec une électrode supérieure lorsqu'un substrat opposé existant et un substrat matriciel sont pressés l'un contre l'autre.
(ZH) 一种对置基板及其制备方法、显示面板以及封装方法,包括:基板(1)和阵列分布在该基板(1)上的间隔柱(2),覆盖在该间隔柱(2)及该基板(1)上的辅助电极层(3),以及至少覆盖在该间隔柱(2)对应的该辅助电极层(3)上的润滑剂层(4),从而解决了现有的对置基板与阵列基板压合时,辅助电极层无法与顶电极接触的问题。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)