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1. WO2019041942 - OPPOSING SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL, AND PACKAGING METHOD

Publication Number WO/2019/041942
Publication Date 07.03.2019
International Application No. PCT/CN2018/090123
International Filing Date 06.06.2018
IPC
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
H01L 51/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO. , LTD. [CN]/[CN]
Inventors
  • 罗程远 LUO, Chengyuan
Agents
  • 北京律智知识产权代理有限公司 BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD.
Priority Data
201710776007.631.08.2017CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) OPPOSING SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL, AND PACKAGING METHOD
(FR) SUBSTRAT OPPOSÉ ET SON PROCÉDÉ DE FABRICATION, PANNEAU D’AFFICHAGE, ET PROCÉDÉ D'ENCAPSULATION
(ZH) 一种对置基板及其制备方法、显示面板以及封装方法
Abstract
(EN)
An opposing substrate and a manufacturing method thereof, a display panel and a packaging method, comprising: a substrate (1); spaced columns (2) arranged in an array on the substrate (1); an auxiliary electrode layer (3) covering both the spaced columns (2) and the substrate (1); and a lubricating layer (4) covering at least the auxiliary electrode layer (3) corresponding to the spaced columns (2), thereby resolving an issue in which an auxiliary electrode layer is unable to make contract with a top electrode when an existing opposing substrate and an array substrate are pressed together.
(FR)
La présente invention porte sur un substrat opposé et son procédé de fabrication, sur un panneau d'affichage et sur un procédé d'encapsulation, comprenant : un substrat (1) ; des colonnes espacées (2) agencées en un réseau sur le substrat (1) ; une couche d'électrode auxiliaire (3) recouvrant à la fois les colonnes espacées (2) et le substrat (1) ; et une couche lubrifiante (4) recouvrant au moins la couche d'électrode auxiliaire (3) correspondant aux colonnes espacées (2), ce qui permet de résoudre le problème selon lequel une couche d'électrode auxiliaire ne peut pas entrer en contact avec une électrode supérieure lorsqu'un substrat opposé existant et un substrat matriciel sont pressés l'un contre l'autre.
(ZH)
一种对置基板及其制备方法、显示面板以及封装方法,包括:基板(1)和阵列分布在该基板(1)上的间隔柱(2),覆盖在该间隔柱(2)及该基板(1)上的辅助电极层(3),以及至少覆盖在该间隔柱(2)对应的该辅助电极层(3)上的润滑剂层(4),从而解决了现有的对置基板与阵列基板压合时,辅助电极层无法与顶电极接触的问题。
Also published as
Latest bibliographic data on file with the International Bureau