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1. WO2019041941 - OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREOF AND OLED DISPLAY DEVICE

Publication Number WO/2019/041941
Publication Date 07.03.2019
International Application No. PCT/CN2018/090093
International Filing Date 06.06.2018
IPC
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
H01L 27/3248
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3248Connection of the pixel electrode to the TFT
H01L 27/3276
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3276Wiring lines
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
  • 成都京东方光电科技有限公司 CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 高永益 KO, Young Yik
  • 董向丹 DONG, Xiangdan
Agents
  • 北京市柳沈律师事务所 LIU, SHEN & ASSOCIATES
Priority Data
201710785779.604.09.2017CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREOF AND OLED DISPLAY DEVICE
(FR) PANNEAU D'AFFICHAGE OLED ET SON PROCÉDÉ DE FABRICATION, ET DISPOSITIF D'AFFICHAGE OLED
(ZH) OLED显示面板及其制造方法、OLED显示装置
Abstract
(EN)
An OLED display panel and a manufacturing method thereof and an OLED display device are disclosed. The OLED display panel comprises a substrate (1), a connection line (5), an insulating layer (2), a source/drain electrode layer (3), and a planarization layer (4). The insulating layer (2) is provided with a first via (6) penetrating the insulating layer (2), the source/drain electrode layer (3) covers the first via (6), and the connection line (5) is located inside the first via (6). A second via (7) penetrating the planarization layer (4) is disposed at a position corresponding to the first via (6) in the planarization layer (4), and the second via (7) communicates with the first via (6). The planarization layer (4) forms a first step (41) with the source/drain electrode layer (3) at the position of the second via (7), and the connection line (5) covers the first step (41). In this way, the connection line (5) is more firmly attached to the planarization layer (4), thereby improving the bond between the OLED display panel and flexible printed circuit boards and the stability of signal transmission.
(FR)
La présente invention concerne un panneau d'affichage OLED et son procédé de fabrication et un dispositif d'affichage OLED. Le panneau d'affichage OLED comprend un substrat (1), une ligne de connexion (5), une couche isolante (2), une couche d'électrode de source/drain (3), et une couche de planarisation (4). La couche isolante (2) est pourvue d'un premier trou d'interconnexion (6) pénétrant dans la couche isolante (2), la couche d'électrode de source/drain (3) recouvre le premier trou d'interconnexion (6), et la ligne de connexion (5) est située à l'intérieur du premier trou d'interconnexion (6). Un second trou d'interconnexion (7) pénétrant dans la couche de planarisation (4) est disposé à une position correspondant au premier trou d'interconnexion (6) dans la couche de planarisation (4), et le second trou d'interconnexion (7) communique avec le premier trou d'interconnexion (6). La couche de planarisation (4) forme un premier étage (41) avec la couche d'électrode de source/drain (3) à la position du second trou d'interconnexion (7), et la ligne de connexion (5) recouvre le premier étage (41). De cette manière, la ligne de connexion (5) est fixée plus fermement à la couche de planarisation (4), ce qui améliore la la liaison entre le panneau d'affichage OLED et les cartes de circuit imprimé flexibles et la stabilité de transmission de signal.
(ZH)
公开一种OLED显示面板及其制造方法、OLED显示装置。OLED显示面板包括基底(1)、连接线(5)、绝缘层(2)、源漏电极层(3)和平坦化层(4),绝缘层(2)上设置有贯穿绝缘层(2)的第一过孔(6),源漏电极层(3)覆盖第一过孔(6),连接线(5)位于第一过孔(6)中;其中平坦化层(4)中与第一过孔(6)对应的位置设置有贯穿平坦化层(4)的第二过孔(7),第二过孔(7)与第一过孔6连通。平坦化层(4)在第二过孔(7)的位置与源漏电极层(3)形成第一台阶(41),连接线(5)覆盖第一台阶(41)。这样,连接线(5)与平坦化层(4)贴覆更为牢固,提高了OLED显示面板与柔性印刷电路板绑定效果和信号传输的稳定性。
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