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1. WO2019041921 - FOLDABLE ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

Publication Number WO/2019/041921
Publication Date 07.03.2019
International Application No. PCT/CN2018/088958
International Filing Date 30.05.2018
IPC
H01L 27/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
G09F 9/30 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
CPC
G09F 9/30
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
G09F 9/301
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
301flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
G09F 9/33
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
H01L 2251/5338
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2251Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
50Organic light emitting devices
53Structure
5338Flexible OLED
H01L 27/1214
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
H01L 27/1218
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
1218with a particular composition or structure of the substrate
Applicants
  • 昆山国显光电有限公司 KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. [CN]/[CN]
Inventors
  • 王刚 WANG, Gang
  • 张露 ZHANG, Lu
  • 韩珍珍 HAN, Zhenzhen
  • 胡思明 HU, Siming
  • 朱晖 ZHU, Hui
Agents
  • 北京布瑞知识产权代理有限公司 BEIJING BRIGHT IP AGENCY CO., LTD.
Priority Data
201710773088.431.08.2017CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FOLDABLE ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
(FR) SUBSTRAT DE RÉSEAU PLIABLE, SON PROCÉDÉ DE FABRICATION, ET DISPOSITIF D’AFFICHAGE
(ZH) 可折叠阵列基板及其制备方法、显示装置
Abstract
(EN)
Provided in the present invention are a foldable array substrate, manufacturing method thereof, and display device. The foldable array substrate comprises a base substrate, a gate metal layer provided on one side of the base substrate, a source-drain metal layer provided on the side of the base substrate opposite to the side of the gate metal layer, and an insulation layer provided between the gate metal layer and the source-drain metal layer. The gate metal layer comprises gate lines and the source-drain metal layer comprises data lines. The gate lines and the data lines cross each other to define multiple pixel units on the base substrate. Openings are provided on the foldable array substrate outside of the pixel units. The openings extend from the side of the base substrate opposite to the insulation layer toward the base substrate. The foldable array substrate, display device, and manufacturing method of the foldable array substrate can improve resistance to bending by means of reducing the stress of the foldable array substrate.
(FR)
La présente invention concerne un substrat de réseau pliable, son procédé de fabrication, et un dispositif d'affichage. Le substrat de réseau pliable comprend un substrat de base, une couche métallique de grille disposée sur un côté du substrat de base, une couche métallique de source-drain disposée sur le côté du substrat de base opposé au côté de la couche métallique de grille, et une couche d'isolation disposée entre la couche métallique de grille et la couche métallique de source-drain. La couche métallique de grille comprend des lignes de grille et la couche métallique de source-drain comprend des lignes de données. Les lignes de grille et les lignes de données se croisent pour définir de multiples unités de pixel sur le substrat de base. Des ouvertures sont ménagées sur le substrat de réseau pliable à l'extérieur des unités de pixels. Les ouvertures s'étendent depuis le côté du substrat de base opposé à la couche d'isolation vers le substrat de base. Le substrat de réseau pliable, le dispositif d'affichage et le procédé de fabrication du substrat de réseau pliable peuvent améliorer la résistance à la flexion au moyen de la réduction de la contrainte du substrat de réseau pliable.
(ZH)
本发明提供可折叠阵列基板及其制备方法、显示装置。该可折叠阵列基板包括衬底基板、设置于衬底基板的一侧的栅金属层、设置于栅金属层的衬底基板所在侧的相反侧的源漏金属层以及设置于栅金属层和源漏金属层之间的绝缘层,栅金属层包括栅线,源漏金属层包括数据线,并且栅线和数据线交叉设置,以在衬底基板上限定多个像素单元,可折叠阵列基板设置有孔,孔不设置在像素单元内,孔从绝缘层的衬底基板所在侧的相反侧朝向衬底基板延伸。采用本发明的可折叠阵列基板、显示装置和该可折叠阵列基板的制备方法,可以通过减小可折叠阵列基板的应力,提高其抗弯折性能。
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