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1. (WO2019041793) DISPLAY SUBSTRATE, DISPLAY APPARATUS, AND METHOD OF MANUFACTURING THEREOF
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Pub. No.: WO/2019/041793 International Application No.: PCT/CN2018/080484
Publication Date: 07.03.2019 International Filing Date: 26.03.2018
IPC:
H01L 51/56 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants:
BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; No.10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
Inventors:
DAI, Qing; CN
Agent:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS; CHEN, Yuan 10th Floor, Tower D, Minsheng Financial Center 28 Jianguomennei Avenue, Dongcheng District Beijing 100005, CN
Priority Data:
201710755090.929.08.2017CN
Title (EN) DISPLAY SUBSTRATE, DISPLAY APPARATUS, AND METHOD OF MANUFACTURING THEREOF
(FR) SUBSTRAT D'AFFICHAGE, APPAREIL D'AFFICHAGE ET PROCÉDÉ DE FABRICATION DE SUBSTRAT D'AFFICHAGE
Abstract:
(EN) The present disclosure is related to a method of manufacturing a display substrate. The method may include forming a pattern layer (100, 200) on a base substrate (300) and forming a first planarization layer (500). The pattern layer (100, 200) may include at least one recess (105). Forming the first planarization layer (500) may include forming a pre-polymerized solution (501) at least in the recess (105) and polymerizing the pre-polymerized solution (501) in the recess (105) to form the first planarization layer (500).
(FR) La présente invention concerne un procédé de fabrication de substrat d'affichage. Le procédé peut comprendre la formation d'une couche de motif (100, 200) sur un substrat de base (300) et la formation d'une première couche de planarisation (500). La couche de motif (100, 200) peut comprendre au moins un évidement (105). La formation de la première couche de planarisation (500) peut comprendre la formation d'une solution pré-polymérisée (501) au moins dans l'évidement (105) et la polymérisation de la solution pré-polymérisée (501) dans l'évidement (105) pour former la première couche de planarisation (500).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)