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1. (WO2019041587) HIGH-RELIABILITY COPPER ALLOY BONDING WIRE FOR ELECTRONIC PACKAGING, AND METHOD FOR MANUFACTURING SAME
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Pub. No.: WO/2019/041587 International Application No.: PCT/CN2017/112638
Publication Date: 07.03.2019 International Filing Date: 23.11.2017
IPC:
H01L 23/49 (2006.01) ,H01L 21/48 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
49
wire-like
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48
Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201
Applicants:
华南理工大学 SOUTH CHINA UNIVERSITY OF TECHNOLOGY [CN/CN]; 中国广东省广州市 南沙区环市大道南路25号华工大广州产研院 Guangzhou Academy of industry and research of South China University of Technology, No.25, South Huanshi Avenue, Nansha District Guangzhou, Guangdong 511458, CN
Inventors:
袁斌 YUAN, Bin; CN
罗政 LUO, Zheng; CN
朱敏 ZHU, Min; CN
徐云管 XU, Yunguan; CN
彭庶瑶 PENG, Shuyao; CN
Agent:
广州市华学知识产权代理有限公司 GUANGZHOU HUAXUE INTELLECTUAL PROPERTY AGENCY CO., LTD.; 中国广东省广州市 天河区五山路381号物资大楼首层 1st Floor Material Building, No.381 Wushan Road, Tianhe District Guangzhou, Guangdong 510640, CN
Priority Data:
201710779698.501.09.2017CN
Title (EN) HIGH-RELIABILITY COPPER ALLOY BONDING WIRE FOR ELECTRONIC PACKAGING, AND METHOD FOR MANUFACTURING SAME
(FR) FIL DE CONNEXION EN ALLIAGE DE CUIVRE À HAUTE FIABILITÉ POUR CONDITIONNEMENT ÉLECTRONIQUE, ET SON PROCÉDÉ DE FABRICATION
(ZH) 一种电子封装用高可靠性铜合金键合丝及其制备方法
Abstract:
(EN) A high-reliability copper alloy bonding wire for electronic packaging, and a method for manufacturing same. The bonding wire comprises the following raw materials by weight percentage: 99.75-99.96% of copper, 0.01-0.1% of tungsten, 0.01-0.03% of silver, 0.01-0.02% of scandium, 0.001-0.03% of titanium, 0.001-0.03% of chromium, and 0.001-0.02% of iron. The method for manufacturing the bonding wire comprises: extracting high-pure copper with a purity larger than 99.99%, manufacturing copper alloy ingots, manufacturing as-cast copper alloy bars, drawing the bars to form copper alloy wires, performing heat treatment, and performing precise drawing, heat treatment, and cleaning to obtain copper alloy bonding wires of different specifications.
(FR) L'invention concerne un fil de connexion en alliage de cuivre à haute fiabilité pour conditionnement électronique, et son procédé de fabrication. Le fil de connexion comprend les matières premières suivantes en pourcentage en poids : 99,75 à 99,96 % de cuivre, 0,01 à 0,1 % de tungstène, 0,01 à 0,03 % d'argent, 0,01 à 0,02 % de scandium, 0,001 à 0,03 % de titane, 0,001 à 0,03 % de chrome et 0,001 à 0,02 % de fer. Le procédé de fabrication du fil de connexion comprend : l'extraction de cuivre ultra-pur d'une pureté supérieure à 99,99 %, la fabrication de lingots d'alliage de cuivre, la fabrication de barres d'alliage de cuivre brut de coulée, l'étirage des barres pour former des fils d'alliage de cuivre, la mise en œuvre d'un traitement thermique et la mise en œuvre d'un étirage précis, d'un traitement thermique et d'un nettoyage pour obtenir des fils de connexion en alliage de cuivre présentant différentes spécifications.
(ZH) 一种电子封装用高可靠性铜合金键合丝及其制备方法,该键合丝的原料成分重量百分比组成为:铜含量为99.75%‐99.96%、钨含量为0.01‐0.1%、银含量为0.01%‐0.03%、钪含量为0.01%‐0.02%、钛含量为0.001%‐0.03%、铬含量为0.001%‐0.03%、铁含量为0.001%‐0.02%。其制备方法包括:提取纯度大于99.99%的高纯铜,制备成铜合金铸锭,再制成铸态铜合金母线,将母线拉制成铜合金丝经热处理后,再经精密拉拔、热处理、清洗后制成不同规格的铜合金键合丝。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)