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1. (WO2019033358) PHOTOSENSITIVE CHIP AND ELECTRONIC DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/033358 International Application No.: PCT/CN2017/097919
Publication Date: 21.02.2019 International Filing Date: 17.08.2017
IPC:
G06K 9/00 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9
Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
Applicants:
深圳信炜科技有限公司 SHENZHEN XINWEI TECHNOLOGY CO., LTD. [CN/CN]; 中国广东省深圳市 南山区西丽街道红花岭工业区南区2区1栋5楼(西边)IP/李唯唯 IP/Li Weiwei (West) Floor 5, Building 1, Block 2, South Area, Honghualing Industrial Zone, Xili Street, Nanshan District Shenzhen, Guangdong 518055, CN
Inventors:
李问杰 LI, Wenjie; CN
Priority Data:
Title (EN) PHOTOSENSITIVE CHIP AND ELECTRONIC DEVICE
(FR) PUCE PHOTOSENSIBLE ET DISPOSITIF ÉLECTRONIQUE
(ZH) 感光芯片及电子设备
Abstract:
(EN) Disclosed are a photosensitive chip and an electronic device. The photosensitive chip comprises a photosensitive bare chip and a filtering film, wherein the filtering film is arranged on the photosensitive bare chip. The electronic device also comprises the photosensitive chip.
(FR) L'invention concerne une puce photosensible et un dispositif électronique. La puce photosensible comprend une puce nue photosensible et un film de filtrage, le film de filtrage étant disposé sur la puce nue photosensible. Le dispositif électronique comprend également la puce photosensible.
(ZH) 本实用新型公开一种感光芯片及电子设备。感光芯片包括感光裸片以及滤光膜,且所述滤光膜设置在所述感光裸片上。所述电子设备均包括该感光芯片。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)