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1. (WO2019032846) METHOD AND APPARATUS FOR FORMING AN ELECTRICAL CIRCUIT INCLUDING ALUMINUM AND ONE OR MORE DISSIMILAR METALS
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Pub. No.: WO/2019/032846 International Application No.: PCT/US2018/046040
Publication Date: 14.02.2019 International Filing Date: 09.08.2018
IPC:
H05K 1/02 (2006.01) ,H05K 1/03 (2006.01) ,H05K 1/09 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
Applicants:
MOLEX, LLC [US/US]; 2222 Wellington Court Lisle, Illinois 60532, US
Inventors:
IRWIN, Robert Cartwright; US
NICHOLS, Steven William; US
Agent:
HUANG, Bo; US
Priority Data:
62/543,73110.08.2017US
Title (EN) METHOD AND APPARATUS FOR FORMING AN ELECTRICAL CIRCUIT INCLUDING ALUMINUM AND ONE OR MORE DISSIMILAR METALS
(FR) PROCÉDÉ ET APPAREIL DE FORMATION D'UN CIRCUIT ÉLECTRIQUE COMPRENANT DE L'ALUMINIUM ET UN OU PLUSIEURS MÉTAUX DISSEMBLABLES
Abstract:
(EN) An electrical circuit includes a substrate, at least one first metal formed on the substrate, and at least one second metal. The second metal is different from the first metal and is formed on the substrate such that at least a portion of the second covers at least a portion of the first metal. The second metal forms an electrical connection with the first metal where the second metal covers the first metal.
(FR) Cette invention concerne un circuit électrique, comprenant un substrat, au moins un premier métal formé sur le substrat, et au moins un second métal. Le second métal est différent du premier métal et est formé sur le substrat de telle sorte qu'au moins une partie du second métal recouvre au moins une partie du premier métal. Le second métal forme une connexion électrique avec le premier métal, là où le second métal recouvre le premier métal.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)