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1. (WO2019032700) SEMICONDUCTOR SUBSTRATE HAVING MAGNETIC CORE INDUCTOR AND METHOD OF MAKING SAME
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What is Claimed is:

1 . A method of forming a magnetic core on a substrate having a stacked inductor coil, comprising:

etching a plurality of polymer layers to form at least one feature through the plurality of polymer layers, wherein the at least one feature is disposed within a central region of a stacked inductor coil formed on the substrate; and

depositing a magnetic material within the at least one feature.

2. The method of claim 1 , wherein etching the plurality of polymer layers comprises:

forming a first patterned masking layer atop an uppermost polymer layer of a plurality of polymer layers;

etching an exposed portion of the uppermost polymer layer through the first patterned masking layer to form at least one feature through the plurality of polymer layers; and

removing the first patterned masking layer.

3. The method of claim 2, wherein the exposed portion of the uppermost polymer layer is etched with a plasma-based dry etching process.

4. The method of claim 1 , wherein depositing the magnetic material comprises: forming a second patterned masking layer atop an uppermost polymer layer; depositing the magnetic material within the at least one feature through the second patterned masking layer; and

removing the second patterned masking layer.

5. The method of claim 4, further comprising:

depositing a seed layer atop the uppermost polymer layer and in the at least one feature prior to forming the second patterned masking layer, wherein the second patterned masking layer is formed atop the seed layer; and

etching the seed layer after removing the second patterned masking layer.

6. The method of claim 5, wherein the seed layer comprises copper.

7. The method of any one of claims 1 -6, further comprising:

etching the plurality of polymer layers to form at least one additional feature through the plurality of polymer layers, wherein the at least one additional feature is a trench disposed around the stacked inductor coil or a plurality of vias disposed around the stacked spiral inductor coil; and

depositing a magnetic material within the at least one additional feature.

8. The method of any one of claims 1 -6, wherein the at least one feature is a high aspect ratio via.

9. The method of any one of claims 1 -6, wherein the magnetic material is deposited via a physical vapor deposition (PVD) process.

10. The method of any one of claims 1 -6, wherein the magnetic material comprises one or more of iron (Fe), nickel (Ni), zinc (Zn), nickel-iron (NiFe), nickel-zinc (NiZn), nickel-zinc-copper (NiZnCu), aluminum-nickel-cobalt (AINiCo), cobalt-tantalum-zirconium (CoTaZr), cobalt-niobium-zirconium (CoNbZr), cobalt-zirconium oxide (CoZr02), iron-hafnium nitride (FeHfN), or cobalt-iron-hafnium oxide (CoFeHfO).

1 1 . The method of any one of claims 1 -6, wherein the at least one feature includes a plurality of features.

12. A substrate for a packaging application, comprising:

a plurality of polymer layers disposed atop a substrate base;

a stacked spiral inductor coil disposed within the plurality of polymer layers; and

at least one magnetic core disposed through the plurality of polymer layers and within a central region defined by the stacked spiral inductor coil.

13. The substrate of claim 12, further comprising a plurality of magnetic cores in the form of vias disposed around the stacked spiral inductor coil.

14. The substrate of claim 12, further comprising at least one magnetic core in the form of a trench disposed around the stacked spiral inductor coil.

15. The substrate of any one of claims 12-14, wherein the at least one magnetic core within the central region is a plurality of magnetic cores disposed through the plurality of polymer layers and within the central region.