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1. (WO2019032486) HOT WALL FLUX FREE SOLDER BALL TREATMENT ARRANGEMENT
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/032486 International Application No.: PCT/US2018/045474
Publication Date: 14.02.2019 International Filing Date: 07.08.2018
IPC:
H01L 21/56 (2006.01) ,H01L 23/48 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
Applicants:
BOSTON PROCESS TECHNOLOGIES, INC. [US/US]; 10 Tech Drive Peabody, Massachusetts 01960, US
Inventors:
ZHANG, Jian; US
Agent:
BOURQUE, Daniel J.; US
Priority Data:
62/605,28807.08.2017US
Title (EN) HOT WALL FLUX FREE SOLDER BALL TREATMENT ARRANGEMENT
(FR) AGENCEMENT DE TRAITEMENT DE BILLE DE SOUDURE SANS FLUX À PAROI CHAUDE
Abstract:
(EN) A vertically oriented treatment chamber (10) for the processing of a flux-free solder ball (or plated solder ball) loaded wafer chip (34). A treatment chamber (10) comprises a first or upper heater (18/24) at an upper end of the treatment chamber and a second or lower heater (70) at a lower end of the treatment chamber. The treatment chamber includes a centrally disposed, preloaded flux free solder ball loaded wafer chip support ring (30) movable upwardly and downwardly within the treatment chamber in response to temperature sensed monitoring of a wafer chip (34) supported on the wafer chip support ring (30).
(FR) L'invention concerne une chambre de traitement orientée verticalement (10) pour le traitement d'une puce de plaquette (34) chargée de billes de soudure sans flux (ou billes de soudure plaquées). Une chambre de traitement (10) comprend un premier élément chauffant ou élément supérieur (18/24) au niveau d'une extrémité supérieure de la chambre de traitement et un second élément chauffant ou élément inférieur (70) au niveau d'une extrémité inférieure de la chambre de traitement. La chambre de traitement comprend un anneau de support de puce de plaquette (30) chargée de billes de soudure sans flux préchargées disposées au centre pouvant se déplacer vers le haut et vers le bas à l'intérieur de la chambre de traitement en réponse à la surveillance de détection de température d'une puce de plaquette (34) supportée sur l'anneau de support de puce de plaquette (30).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)