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1. (WO2019032485) FLUX-FREE SOLDER BALL MOUNT ARRANGEMENT
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/032485 International Application No.: PCT/US2018/045473
Publication Date: 14.02.2019 International Filing Date: 07.08.2018
IPC:
H01L 21/3213 (2006.01) ,H01L 21/48 (2006.01) ,H05K 3/12 (2006.01) ,B23K 1/20 (2006.01) ,B23K 31/02 (2006.01) ,C25D 5/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31
to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
3205
Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layers; After-treatment of these layers
321
After-treatment
3213
Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48
Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12
using printing techniques to apply the conductive material
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
20
Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
31
Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/-B23K28/193
02
relating to soldering or welding
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
02
Electroplating of selected surface areas
Applicants:
BOSTON PROCESS TECHNOLOGIES, INC. [US/US]; 10 Tech Drive Peabody, Massachusetts 01960, US
Inventors:
ZHANG, Jian; US
Agent:
BOURQUE, Daniel J.; US
Priority Data:
62/605,27707.08.2017US
Title (EN) FLUX-FREE SOLDER BALL MOUNT ARRANGEMENT
(FR) AGENCEMENT DE MONTAGE DE BILLE DE SOUDURE SANS FLUX
Abstract:
(EN) A system for the flux free processing of a plurality of solder balls (86) on a wafer (12), comprising: an articulable vacuum support chuck (18) for maintaining support of a plurality of solder balls (86) on a wafer (12) being processed. An articulable flux-free binder applicator (32) is arranged in a binder depositing relationship with the wafer (12) within the treatment chamber. An articulable fluid dispenser is arranged in a binder-applied minimization-treatment with respect to the flux free binder (38) applied to the wafer (12) within the treatment chamber.
(FR) L'invention concerne un système pour le traitement sans flux d'une pluralité de billes de soudure (86) sur une plaquette (12), comprenant : un mandrin de support sous vide articulable (18) pour maintenir le support d'une pluralité de billes de soudure (86) sur une plaquette (12) en cours de traitement. Un applicateur de liant sans flux articulable (32) est disposé dans une relation de dépôt de liant avec la plaquette (12) à l'intérieur de la chambre de traitement. Un distributeur de fluide articulable est disposé dans un traitement de minimisation appliqué par liant par rapport au liant sans flux (38) appliqué à la plaquette (12) à l'intérieur de la chambre de traitement.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)