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1. (WO2019032468) MULTI-PLATE FACEPLATE FOR A PROCESSING CHAMBER
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/032468 International Application No.: PCT/US2018/045424
Publication Date: 14.02.2019 International Filing Date: 06.08.2018
IPC:
H01L 21/67 (2006.01) ,H01J 37/32 (2006.01) ,H05H 1/46 (2006.01) ,H01L 21/687 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H
PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY- CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
1
Generating plasma; Handling plasma
24
Generating plasma
46
using applied electromagnetic fields, e.g. high frequency or microwave energy
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
687
using mechanical means, e.g. chucks, clamps or pinches
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors:
SRIKANTAIAH, Deepak Doddabelavangala; US
TULSHIBAGWALE, Sheshraj L.; US
SINGH, Saravjeet; US
TAM, Alexander; US
Agent:
PATTERSON, B. Todd; US
TABOADA, Keith; US
Priority Data:
15/671,90908.08.2017US
Title (EN) MULTI-PLATE FACEPLATE FOR A PROCESSING CHAMBER
(FR) PLATEAU FRONTAL MULTI-PLAQUES POUR UNE CHAMBRE DE TRAITEMENT
Abstract:
(EN) Embodiments of the disclosure relate to a multi-plate faceplate having a first plate and a second plate. The first plate has a plurality of first plate openings. The second plate has a first surface, an opposed second surface and a plurality of second plate openings extending therethrough. The first surface is mechanically coupled to the first plate. A second plate opening has a conical portion configured to be fluidly coupled to a first plate opening and decreasing in cross-section in the depth direction thereof from the second surface. A surface of the conical portion is coated with a protective coating adjacent to the first and second surfaces. In another embodiment, the first plate has a protrusion extending therefrom into a recess formed inwardly of the first surface. The protrusion has a passage extending therethrough fluidly connected to the recess, which is fluidly connected to the second plate opening.
(FR) Selon certains modes de réalisation, cette invention concerne un plateau frontal multi-plaques ayant une première plaque et une seconde plaque. La première plaque présente une pluralité de premières ouvertures de plaque. La seconde plaque présente une première surface, une seconde surface opposée et une pluralité de secondes ouvertures de plaque s'étendant à travers celle-ci. La première surface est mécaniquement accouplée à la première plaque. Une seconde ouverture de plaque a une partie conique configurée pour être mise en communication fluidique avec une première ouverture de plaque et diminuer en section transversale dans le sens de la profondeur de celle-ci, à partir de la seconde surface. Une surface de la partie conique est revêtue d'un revêtement protecteur de manière adjacente aux première et seconde surfaces. Selon un autre mode de réalisation, la première plaque présente une saillie s'étendant à partir de celle-ci dans un renfoncement formé vers l'intérieur de la première surface. La saillie a un passage s'étendant à travers celle-ci en communication fluidique avec l'évidement, qui est en communication fluidique avec la seconde ouverture de plaque.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)