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1. (WO2019032434) MULTILAYER FRAME PACKAGES FOR INTEGRATED CIRCUITS HAVING A MAGNETIC SHIELD INTEGRATED THEREIN, AND METHODS THEREFOR
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/032434 International Application No.: PCT/US2018/045334
Publication Date: 14.02.2019 International Filing Date: 06.08.2018
IPC:
H01L 23/552 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
552
Protection against radiation, e.g. light
Applicants:
EVERSPIN TECHNOLOGIES, INC. [US/US]; 5670 W. Chandler Blvd. Suite 100 Chandler, AZ 85226, US
Inventors:
UGGE, Angelo, V.; US
Agent:
KNOFF, Elissa; US
Priority Data:
62/542,53508.08.2017US
Title (EN) MULTILAYER FRAME PACKAGES FOR INTEGRATED CIRCUITS HAVING A MAGNETIC SHIELD INTEGRATED THEREIN, AND METHODS THEREFOR
(FR) BOÎTIERS DE CADRE MULTICOUCHE POUR CIRCUITS INTÉGRÉS AYANT UN BLINDAGE MAGNÉTIQUE INTÉGRÉ DANS CEUX-CI, ET PROCÉDÉS ASSOCIÉS
Abstract:
(EN) An integrated circuit package may comprise a multilayer frame package including: a bottom layer; and a magnetic shield layer; including a sub-frame and a magnetic shield disposed within a periphery of the sub-frame; and an integrated circuit die provided on or above the magnetic shield layer of the multilayer frame package.
(FR) L'invention concerne un boîtier de circuit intégré pouvant comprendre un boîtier de cadre multicouche comprenant : une couche inférieure; et une couche de blindage magnétique; comprenant un sous-cadre et un blindage magnétique disposé à l'intérieur d'une périphérie du sous-cadre; et une puce de circuit intégré disposée sur ou au-dessus de la couche de blindage magnétique du boîtier de cadre multicouche.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)