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1. (WO2019032418) SOLDER PASTE NOZZLE, WORK-TABLE AND SOLDER PASTE ADDITION DEVICE WITH SUCH NOZZLE AND WORK-TABLE
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Claims

1. A solder paste nozzle (200, 800), characterized by comprising:

an upper nozzle portion (210, 810), a lower nozzle portion (230, 830), and a film (220, 820) disposed between the upper nozzle portion (210, 810) and the lower nozzle portion (230, 830);

a solder paste nozzle through-hole (280, 880) penetrating through the upper nozzle portion (210, 810), the lower nozzle portion (230, 830) and the film (220, 820), wherein the solder paste nozzle through-hole (280, 880) forms a lower nozzle through-hole (236, 836) in the lower nozzle portion (230, 830); and

a deformation space (219, 819), the deformation space (219, 819) being disposed between an upper surface of the film (220, 820) and the upper nozzle portion (210, 810) and/or between a lower surface of the film (220, 820) and the lower nozzle portion (230, 830);

wherein the lower nozzle portion (230, 830) is provided with at least one nozzle duct (233.1, 233.2; 833.1, 833.2) to enable a gas flow to be blown upwardly to the film (220, 820) through the at least one nozzle duct (233.1, 233.2; 833.1, 833.2) to upwardly deform the film (220, 820), thereby forming a gas flow passage between the film (220, 820) and the lower nozzle portion (230, 830) to enable a gas flow to enter the lower nozzle through-hole (236, 836) via the gas flow passage to blow residual solder paste out of the lower nozzle through-hole (236, 836).

2. The solder paste nozzle as claimed in claim 1, characterized in that:

the at least one nozzle duct (233.1, 233.2; 833.1, 833.2) has a nozzle duct outlet (239.1, 239.2; 839.1, 839.2), the nozzle duct outlet (239, 239.2; 839.1, 839.2) is disposed on a top surface of the lower nozzle portion (230, 830), and the film (220, 820) covers the nozzle duct outlet (239.1, 239.2; 839.1, 839.2).

3. The solder paste nozzle as claimed in claim 2, characterized in that:

the deformation space (219) is disposed at the bottom of the upper nozzle portion (210, 810), and the deformation space (219) at least partially covers the nozzle duct outlet (239.1, 239.2; 839.1, 839.2).

4. The solder paste nozzle as claimed in claim 2, characterized in that:

the deformation space (819) is disposed at the top of the lower nozzle portion (230, 830), and the deformation space (819) is in communication with the at least one nozzle duct (233.1, 233.2; 833.1, 833.2).

5. The solder paste nozzle as claimed in claim 1, characterized in that:

the upper nozzle portion (210, 810) has a head (212, 812), the head (212, 812) being able to be inserted into a solder paste tank containing solder paste and to move relative to the solder paste tank so as to enable the solder paste to flow out of the solder paste nozzle through-hole (280, 880).

6. The solder paste nozzle as claimed in claim 1, characterized in that:

the film (220, 820) is made of a rubber material or another elastic material.

7. A worktable of a solder paste addition device, characterized by comprising: at least one worktable duct (610.1, 610.2), each of the at least one worktable ducts (610.1, 610.2) comprising a worktable duct inlet (608.1, 608.2) and a worktable duct outlet (609.1, 609.2), the worktable duct inlet (608.1, 608.2) being used to be in communication with a gas source to deliver a gas flow from a gas source to the worktable duct outlet (609.1, 609.2), and the worktable duct outlet (609.1, 609.2) being used to provide a gas flow blown over the worktable (600).

8. The worktable as claimed in claim 7, characterized in that:

the worktable (600) further comprises an opening (603) for accommodating a lower end of a solder paste nozzle (200, 800), and the worktable duct (610) is used to provide a gas flow for a nozzle duct (233.1, 233.2; 833.1, 833.2) of the solder paste nozzle (200, 800) accommodated in the worktable (600).

9. The worktable as claimed in claim 7, characterized in that:

the worktable (600) comprises an upper surface (641) and a lower surface (642), and the worktable duct outlet (609.1, 609.2) is disposed on the upper surface (641).

10. The worktable as claimed in claim 9, characterized in that:

the worktable duct (610) comprises a first passage portion (625) and a second passage portion (626), the first passage portion (625) being connected to a gas source, and one end of the second passage portion (626) being connected to the first passage portion (625) and the other end thereof being connected to the worktable duct outlet (609.1, 609.2), wherein the second passage portion (626) is arranged to be formed by extending upwardly from the first passage portion (625).

11. A solder paste addition device, characterized by comprising:

a solder paste nozzle (200, 800), the solder paste nozzle (200, 800) comprising:

an upper nozzle portion (210, 810), a lower nozzle portion (230, 830), and a film (220, 820) disposed between the upper nozzle portion (210, 810) and the lower nozzle portion (230, 830);

a solder paste nozzle through-hole (280, 880) penetrating through the upper nozzle portion (210, 810), the lower nozzle portion (230, 830) and the film (220, 820), wherein the solder paste nozzle through-hole (280, 880) forms a lower nozzle through-hole (236, 836) in the lower nozzle portion (230, 830); and

a deformation space (219, 819), the deformation space (219, 819) being disposed between an upper surface of the film (220, 820) and the upper nozzle portion (210, 810) and/or between a lower surface of the film (220, 820) and the lower nozzle portion (230, 830);

wherein the lower nozzle portion (230, 830) is provided with at least one nozzle duct (233.1, 233.2; 833.1, 833.2) to enable a gas flow to be blown upwardly to the film (220, 820) through the at least one nozzle duct (233.1, 233.2; 833.1, 833.2) to upwardly deform the film (220, 820), thereby forming a gas flow passage between the film (220, 820) and the lower nozzle portion (230, 830) to enable a gas flow to enter the lower nozzle through-hole (236, 836) via the gas flow passage to blow residual solder paste out of the lower nozzle through-hole (236, 836); and

a worktable (600), the worktable (600) carrying the solder paste nozzle (200, 800), the worktable (600) comprising at least one worktable duct (610.1, 610.2), and the at least one worktable duct (610.1, 610.2) being configured to be in fluid communication with the at least one nozzle duct (233.1, 233.2; 833.1, 833.2) for delivering the gas flow into the at least one nozzle duct (233.1, 233.2; 833.1, 833.2).

12. The solder paste addition device as claimed in claim 11, characterized in that: the at least one nozzle duct (233.1, 233.2; 833.1, 833.2) has a nozzle duct inlet (237.1,

237.2; 837.1, 837.2) located at a bottom surface of the lower nozzle portion (230, 830), the at least one workspace duct (610.1, 610.2) has a worktable duct outlet (609.1, 609.2) located at an upper surface of the worktable (600), and the nozzle duct inlet (237.1, 237.2; 837.1, 837.2) is aligned with the worktable duct outlet (609.1, 609.2).

13. The solder paste addition device as claimed in claim 11, characterized in that: the at least one nozzle duct (233.1, 233.2; 833.1, 833.2) has a nozzle duct outlet

(239.1, 239.2; 839.1, 839.2), the nozzle duct outlet (239, 239.2; 839.1, 839.2) is disposed on a top surface of the lower nozzle portion (230, 830), and the film (220, 820) covers the nozzle duct outlet (239.1, 239.2; 839.1, 839.2).

14. The solder paste addition device as claimed in claim 13, characterized in that: the deformation space (219) is disposed at the bottom of the upper nozzle portion

(210, 810), and the deformation space (219) at least partially covers the nozzle duct outlet (239.1, 239.2; 839.1, 839.2).

15. The solder paste nozzle as claimed in claim 13, characterized in that:

the deformation space (819) is disposed at the top of the lower nozzle portion (230, 830), and the deformation space (819) is in communication with the at least one nozzle duct (233.1, 233.2; 833.1, 833.2).