Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019032251) SEMICONDUCTOR MOLD COMPOUND TRANSFER SYSTEM AND ASSOCIATED METHODS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/032251 International Application No.: PCT/US2018/042525
Publication Date: 14.02.2019 International Filing Date: 17.07.2018
IPC:
H01L 21/67 (2006.01) ,H01L 21/56 (2006.01) ,H01L 23/28 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
Applicants:
MICRON TECHNOLOGY, INC. [US/US]; 8000 S. Federal Way, P.O. Box 6 Boise, ID 83707-0006, US
Inventors:
KOH, Kean, Tat; SG
CHOONG, Lien, Wah; SG
Agent:
PARKER, Paul, T.; US
ARNETT, Stephen, E.; US
AI, Bing; US
PARKER, Paul, T.; US
FAREID, Asphahani; US
Priority Data:
15/670,35107.08.2017US
Title (EN) SEMICONDUCTOR MOLD COMPOUND TRANSFER SYSTEM AND ASSOCIATED METHODS
(FR) SYSTÈME DE TRANSFERT DE COMPOSÉ DE MOULAGE À SEMI-CONDUCTEUR ET PROCÉDÉS ASSOCIÉS
Abstract:
(EN) Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes placing a sheet mold compound in a containment area defined by a tray cover, and dispensing a granular mold compound over the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed grains to a molding machine without using a release film.
(FR) L'invention concerne des systèmes de transfert de composé de moulage et des procédés de fabrication de systèmes de transfert de composé de moulage. Un procédé configuré conformément à un mode de réalisation particulier comprend le placement d'un composé de moulage en feuille dans une zone de confinement définie par un couvercle de plateau, et la distribution d'un composé de moulage granulaire sur le composé de moulage en feuille. Le composé de moulage en feuille peut avoir une première densité et le composé de moulage granulaire globale peut avoir une seconde densité inférieure à la première densité. Le procédé comprend en outre le transfert de la feuille solide portant les grains distribués à une machine de moulage sans utiliser de film de libération.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)