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1. (WO2019032115) QUBIT DEVICES WITH JOSEPHSON JUNCTIONS CONNECTED BELOW SUPPORTING CIRCUITRY
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/032115 International Application No.: PCT/US2017/046404
Publication Date: 14.02.2019 International Filing Date: 11.08.2017
IPC:
H01L 39/22 (2006.01) ,H01L 39/24 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
39
Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
22
Devices comprising a junction of dissimilar materials, e.g. Josephson-effect devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
39
Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
24
Processes or apparatus specially adapted for the manufacture or treatment of devices provided for in group H01L39/135
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054-1549, US
Inventors:
CAUDILLO, Roman; US
YOSCOVITS, Zachary, R.; US
GEORGE, Hubert, C.; US
PILLARISETTY, Ravi; US
THOMAS, Nicole, K.; US
MICHALAK, David, J.; US
ROBERTS, Jeanette, M.; US
SINGH, Kanwaljit; NL
CLARKE, James, S.; US
Agent:
HARTMANN, Natalya; US
Priority Data:
Title (EN) QUBIT DEVICES WITH JOSEPHSON JUNCTIONS CONNECTED BELOW SUPPORTING CIRCUITRY
(FR) DISPOSITIFS À BITS QUANTIQUES À JONCTIONS JOSEPHSON CONNECTÉES EN DESSOUS DE CIRCUITS DE SUPPORT
Abstract:
(EN) Embodiments of the present disclosure propose methods of fabricating quantum circuit assemblies that include Josephson Junctions connected below the plane of supporting circuitry. A exemplary quantum circuit assembly includes supporting circuitry in the form of a first and a second conductive circuit elements provided over a substrate, each circuit element having an upper portion and a lower portion. Such a quantum circuit assembly further includes a Josephson Junction provided over the substrate and electrically connected to the first and second conductive circuit elements via a first lead and a second lead, where the first lead electrically connects a first electrode of the Josephson Junction to the lower portion of the first conductive circuit element, and the second lead electrically connects a second electrode of the Josephson Junction to the lower portion of the second conductive circuit element.
(FR) Des modes de réalisation de la présente invention proposent des procédés de fabrication d'ensembles circuit quantique qui comprennent des jonctions Josephson connectées au-dessous du plan de circuits de support. Un ensemble circuit quantique donné à titre d'exemple comprend des circuits de support sous la forme d'un premier et d'un second élément de circuit conducteur disposés sur un substrat, chaque élément de circuit ayant une partie supérieure et une partie inférieure. Un tel ensemble circuit quantique comprend en outre une jonction Josephson disposée sur le substrat et connectée électriquement aux premier et second éléments de circuit conducteur par l'intermédiaire d'un premier fil et d'un second fil, le premier fil connectant électriquement une première électrode de la jonction Josephson à la partie inférieure du premier élément de circuit conducteur, et le second fil connectant électriquement une seconde électrode de la jonction Josephson à la partie inférieure du second élément de circuit conducteur.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)