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1. (WO2019031922) LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING DEVICE PACKAGE MODULE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031922 International Application No.: PCT/KR2018/009188
Publication Date: 14.02.2019 International Filing Date: 10.08.2018
IPC:
H01L 33/50 (2010.01) ,H01L 33/52 (2010.01) ,H01L 33/20 (2010.01) ,H01L 25/075 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
50
Wavelength conversion elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
characterised by the semiconductor bodies
20
with a particular shape, e.g. curved or truncated substrate
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
Applicants:
SAMSUNG ELECTRONICS CO., LTD. [KR/KR]; 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 16677, KR
Inventors:
IM, Sang Kyun; KR
TETSUYA, Shigeta; KR
LEE, Ho Seop; KR
CHO, Seong-Phil; KR
Agent:
SELIM INTELLECTUAL PROPERTY LAW FIRM; 10F and 11F, Taewoo Bldg. 285, Gangnam-daero Seocho-gu Seoul 06729, KR
Priority Data:
10-2017-010230011.08.2017KR
Title (EN) LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING DEVICE PACKAGE MODULE
(FR) BOÎTIER DE DISPOSITIF ÉLECTROLUMINESCENT ET MODULE DE BOÎTIER DE DISPOSITIF ÉLECTROLUMINESCENT
Abstract:
(EN) A light emitting device package includes a light emitting device that generates light, a body frame including a cavity in which the light emitting device is mounted, a molding material that fills the cavity, and absorbing pigments that convert the light generated by the light emitting device. The absorbing pigments have a peak value within a wavelength range of 490 to 520 nm and a full width at half maximum (FWHM) of 40 to 70 nm.
(FR) Un boîtier de dispositif électroluminescent selon l'invention comprend un dispositif électroluminescent qui génère de la lumière, un cadre de corps comprenant une cavité dans laquelle le dispositif électroluminescent est monté, un matériau de moulage qui remplit la cavité, et des pigments d'absorption qui convertissent la lumière générée par le dispositif électroluminescent. Les pigments absorbants ont une valeur de pic dans une plage de longueurs d'onde de 490 à 520 nm et une largeur totale à mi-hauteur (FWHM) de 40 à 70 nm.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)