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1. (WO2019031789) POLISHING PAD HAVING EXCELLENT AIRTIGHTNESS
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031789 International Application No.: PCT/KR2018/008897
Publication Date: 14.02.2019 International Filing Date: 06.08.2018
IPC:
B24B 37/20 (2012.01) ,B24B 37/22 (2012.01) ,H01L 21/306 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
11
Lapping tools
20
Lapping pads for working plane surfaces
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
11
Lapping tools
20
Lapping pads for working plane surfaces
22
characterised by a multi-layered structure
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
306
Chemical or electrical treatment, e.g. electrolytic etching
Applicants:
에스케이씨 주식회사 SKC CO., LTD. [KR/KR]; 경기도 수원시 장안구 장안로 309번길 84 84, Jangan-ro 309beon-gil, Jangan-gu, Suwon-si, Gyeonggi-do 16336, KR
Inventors:
윤성훈 YUN, Sunghoon; KR
서장원 SEO, Jang Won; KR
안재인 AHN, Jaein; KR
윤종욱 YUN, Jong Wook; KR
허혜영 HEO, Hye Young; KR
Agent:
제일특허법인(유) FIRSTLAW P.C.; 서울시 서초구 마방로 60 60 Mabang-Ro, Seocho-Ku, Seoul 06775, KR
Priority Data:
10-2017-009952807.08.2017KR
Title (EN) POLISHING PAD HAVING EXCELLENT AIRTIGHTNESS
(FR) TAMPON À POLIR PRÉSENTANT UNE EXCELLENTE ÉTANCHÉITÉ À L'AIR
(KO) 우수한 기밀성을 갖는 연마패드
Abstract:
(EN) An embodiment relates to a polishing pad which is used in a chemical mechanical planarization (CMP) process and has excellent airtightness, wherein the polishing pad is excellent in airtightness of a window opening and thus can prevent water leakage that may occur during a CMP process.
(FR) Un mode de réalisation concerne un tampon à polir qui est utilisé dans un traitement de planarisation mécanochimique (CMP) et qui présente une excellente étanchéité à l'air, le tampon à polir présentant d'excellentes propriétés en termes d'étanchéité à l'air d'une ouverture de fenêtre et pouvant ainsi empêcher une fuite d'eau qui peut se produire pendant un traitement de CMP.
(KO) 실시예는 화학적 기계적 평탄화(chemical mechanical planarization, CMP) 공정에 사용되며, 우수한 기밀성을 갖는 연마패드에 관한 것으로서, 상기 연마패드는 윈도우 개구부의 기밀성이 우수하여 CMP 공정 중 발생할 수 있는 누수를 방지할 수 있다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)