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1. (WO2019031706) CONDUCTIVE MOD INK COMPOSITION HAVING EXCELLENT LIGHT ABSORPTION COEFFICIENT AND METAL THIN FILM FORMING METHOD USING SAME
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031706 International Application No.: PCT/KR2018/007527
Publication Date: 14.02.2019 International Filing Date: 03.07.2018
IPC:
C09D 11/52 (2014.01) ,C09D 11/03 (2014.01) ,C09D 11/037 (2014.01) ,B05D 7/24 (2006.01) ,B05D 3/02 (2006.01) ,B05D 7/02 (2006.01) ,C23C 18/14 (2006.01)
[IPC code unknown for C09D 11/52][IPC code unknown for C09D 11/03][IPC code unknown for C09D 11/037]
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
7
Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
24
for applying particular liquids or other fluent materials
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3
Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
02
by baking
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
7
Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
02
to macromolecular substances, e.g. rubber
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
14
Decomposition by irradiation, e.g. photolysis, particle radiation
Applicants:
주식회사 비에스피 BSP CO., LTD. [KR/KR]; 경기도 안양시 동안구 부림로170번길 41-4, 6층 6th floor 41-4, Burim-ro 170beon-gil Dongan-gu, Anyang-si Gyeonggi-do 14055, KR
Inventors:
박홍진 PARK, Hong-Jin; KR
서종현 SUH, Jong-Hyun; KR
최동권 CHOI, Dong-Kwon; KR
윤승재 YUNE, Seung-Jae; KR
Agent:
고길수 KO, Kil-Su; KR
Priority Data:
10-2017-010084009.08.2017KR
Title (EN) CONDUCTIVE MOD INK COMPOSITION HAVING EXCELLENT LIGHT ABSORPTION COEFFICIENT AND METAL THIN FILM FORMING METHOD USING SAME
(FR) COMPOSITION D'ENCRE MOD CONDUCTRICE AYANT UN EXCELLENT COEFFICIENT D'ABSORPTION DE LA LUMIÈRE ET PROCÉDÉ DE FORMATION DE FILM MINCE MÉTALLIQUE L'UTILISANT
(KO) 광 흡수 계수가 우수한 전도성 MOD 잉크 조성물 및 이를 이용한 금속 박막 형성방법
Abstract:
(EN) The present invention relates to a conductive MOD ink composition containing: a copper formate-amine ink comprising a copper formate formed by a reaction of a copper precursor and formic acid and an amine group as a ligand; and 0.1-20 parts by weight of a silver (Ag) ion ink relative to 100 parts by weight of the copper formate-amine ink, wherein the silver (Ag) ion ink comprises: at least one silver (Ag) precursor selected from the group consisting of Ag2O and AgNO3; and an amine group as a ligand, and to a metal thin film forming method using the same. According to the present invention, a metal thin film has excellent electric conductivity, can be manufactured at even a low cost, and can implement high light absorption ability. Furthermore, a metal thin film can be formed by applying a low-temperature light sintering process, and a metal thin film having excellent adhesion with a polymer film can be formed.
(FR) La présente invention concerne une composition d'encre MOD conductrice contenant : une encre de formiate de cuivre-amine comprenant un formiate de cuivre formé par une réaction d'un précurseur de cuivre et d'acide formique et un groupe amine en tant que ligand ; et 0,1 à 20 parties en poids d'une encre à base d'ion argent (Ag) rapporté à 100 parties en poids de l'encre à base de formiate de cuivre-amine, l'encre à base d'ion argent (Ag) comprenant : au moins un précurseur d'argent (Ag) choisi dans le groupe constitué par Ag2O et AgNO3 ; et un groupe amine en tant que ligand, et un procédé de formation de film mince métallique l'utilisant. Selon la présente invention, le film mince métallique a une excellente conductivité électrique, peut être fabriqué même à un faible coût, et peut permettre une capacité d'absorption de lumière élevée. En outre, le film mince métallique peut être formé par application d'un procédé de frittage à la lumière à basse température, et un film mince métallique présentant une excellente adhérence à un film polymère peut être formé.
(KO) 본 발명은, 구리 전구체와 포름산이 반응하여 형성된 구리 포메이트와 리간드로서 아민기를 포함하는 구리 포메이트- 아민 잉크와, 상기 구리 포메이트- 아민 잉크 100중량부에 대하여 은(Ag) 이온 잉크 0.1∼20중량부를 포함하며, 상기 은(Ag) 이온 잉크는 Ag2O 및 AgNO3로 이루어진 군으로부터 선택된 1종 이상의 은(Ag) 전구체와 리간드로서 아민기를 포함하는 것을 특징으로 하는 전도성 MOD 잉크 조성물 및 이를 이용한 금속 박막 형성방법에 관한 것이다. 본 발명에 의하면, 전기 전도성이 우수하면서도 낮은 가격으로도 제조가 가능하며, 높은 광흡수 능력 구현이 가능하고, 저온 광 소결 공정을 적용하여 금속 박막을 형성할 수 있으며, 폴리머 필름과의 접착력이 우수한 금속 박막을 형성할 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)