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1. (WO2019031612) HIGH STRENGTH/HIGHLY CONDUCTIVE COPPER ALLOY PLATE MATERIAL AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031612 International Application No.: PCT/JP2018/030132
Publication Date: 14.02.2019 International Filing Date: 10.08.2018
IPC:
C22C 9/00 (2006.01) ,C22F 1/08 (2006.01) ,H01B 1/02 (2006.01) ,H01B 13/00 (2006.01) ,C22F 1/00 (2006.01)
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
08
of copper or alloys based thereon
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
02
mainly consisting of metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Applicants:
田中貴金属工業株式会社 TANAKA KIKINZOKU KOGYO K. K. [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouci 2-chome, Chiyoda-ku, Tokyo 1006422, JP
Inventors:
齋藤 裕介 SAITO Yusuke; JP
岸本 貴臣 KISHIMOTO Takaomi; JP
中野 成之 NAKANO Sigeyuki; JP
Agent:
特許業務法人サクラ国際特許事務所 SAKURA PATENT OFFICE, P.C.; 東京都千代田区内神田一丁目18番14号 ヨシザワビル Yoshizawa Bldg., 18-14, Uchikanda 1-chome, Chiyoda-ku, Tokyo 1010047, JP
Priority Data:
2017-15613410.08.2017JP
Title (EN) HIGH STRENGTH/HIGHLY CONDUCTIVE COPPER ALLOY PLATE MATERIAL AND METHOD FOR PRODUCING SAME
(FR) MATÉRIAU DE PLAQUE D'ALLIAGE DE CUIVRE À HAUTE RÉSISTANCE/HAUTEMENT CONDUCTEUR ET PROCÉDÉ DE PRODUCTION ASSOCIÉ
(JA) 高強度・高導電性銅合金板材およびその製造方法
Abstract:
(EN) Provided is a high strength/highly conductive copper alloy plate material which is practically applicable to conductive members that are required to have high strength and conductivity. A high strength/highly conductive copper alloy plate material according to the present invention contains from 4% by mass to 13% by mass (inclusive) of silver, with the balance being made up of copper and unavoidable impurities. This high strength/highly conductive copper alloy plate material has a minimum value of the tensile strength (UTS) of from 600 MPa to 1,250 MPa (inclusive) and a conductivity (%IACS) of from 60% to 90% (inclusive).
(FR) L'invention concerne un matériau de plaque d'alliage de cuivre à haute résistance/hautement conducteur, applicable en pratique à des éléments conducteurs devant être dotés d'une résistance et d'une conductivité élevées. Le matériau de plaque d'alliage de cuivre à haute résistance/hautement conducteur selon l'invention contient de 4% à 13% en masse (inclus) d'argent, le reste étant constitué de cuivre et d'impuretés inévitables. Ce matériau de plaque d'alliage de cuivre à haute résistance/hautement conducteur présente une valeur minimale de résistance à la traction (RT) de 600 à 1250 MPa (inclus) et une conductivité de 60 à 90% IACS (inclus).
(JA) 強度や導電率が求められる導電部材に実用的に適用可能な高強度・高導電性銅合金板材を提供する。本発明の高強度・高導電性銅合金板材は、銀を4質量%以上13質量%以下の範囲で含み、残部が銅および不可避不純物からなる。高強度・高導電性銅合金板材において、引張強度(UTS)の最小値が600MPa以上1250MPa以下であり、かつ導電率(%IACS)が60%以上90%以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)