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1. (WO2019031590) SUBSTRATE PROCESSING DEVICE
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Pub. No.: WO/2019/031590 International Application No.: PCT/JP2018/029961
Publication Date: 14.02.2019 International Filing Date: 09.08.2018
IPC:
H01L 21/677 (2006.01) ,H01L 21/304 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
株式会社荏原製作所 EBARA CORPORATION [JP/JP]; 東京都大田区羽田旭町11番1号 11-1, Haneda Asahi-cho, Ohta-ku, Tokyo 1448510, JP
Inventors:
前田 幸次 MAEDA Koji; JP
稲葉 充彦 INABA Mitsuhiko; JP
徐 海洋 XU Haiyang; JP
八嶋 哲也 YASHIMA Tetsuya; JP
Agent:
大野 聖二 OHNO Seiji; JP
松野 知紘 MATSUNO Tomohiro; JP
野本 裕史 NOMOTO Hiroshi; JP
Priority Data:
2017-15521310.08.2017JP
Title (EN) SUBSTRATE PROCESSING DEVICE
(FR) DISPOSITIF DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理装置
Abstract:
(EN) A substrate processing device provided with a first processing unit and a second processing unit arranged in two stages vertically. Each of the first processing unit and the second processing unit includes: a plurality of processing tanks arrayed in series; a separating wall defining a transfer space extending in an array direction outside the plurality of processing tanks; a transfer mechanism which is arranged in the transfer space and transfers a substrate between the processing tanks in the array direction; and an air-introducing duct provided in the transfer space and extending in the array direction. A fan filter unit is connected to the air-introducing duct. An exhaust duct is connected to each of the processing tanks. The air-introducing duct is formed with openings in portions opposing the processing tanks. The transfer space of the first processing unit and the transfer space of the second processing unit are separated vertically by means of a separating wall.
(FR) L'invention concerne un dispositif de traitement de substrat comprenant une première unité de traitement et une seconde unité de traitement agencées en deux étages verticalement. Chacune de la première unité de traitement et de la seconde unité de traitement comprend : une pluralité de réservoirs de traitement disposés en série; une paroi de séparation définissant un espace de transfert s'étendant dans une direction de réseau à l'extérieur de la pluralité de réservoirs de traitement; un mécanisme de transfert qui est disposé dans l'espace de transfert et transfère un substrat entre les réservoirs de traitement dans la direction de réseau; et un conduit d'introduction d'air disposé dans l'espace de transfert et s'étendant dans la direction de réseau. Une unité de filtre de ventilateur est reliée au conduit d'introduction d'air. Un conduit d'échappement est relié à chacun des réservoirs de traitement. Le conduit d'introduction d'air est formé avec des ouvertures dans des parties opposées aux réservoirs de traitement. L'espace de transfert de la première unité de traitement et l'espace de transfert de la seconde unité de traitement sont séparés verticalement au moyen d'une paroi de séparation.
(JA) 基板処理装置は、上下二段に配置された第1処理ユニットおよび第2処理ユニットを備える。第1処理ユニットおよび第2処理ユニットは、それぞれ、直列に配列された複数の処理槽と、複数の処理槽の外側に配列方向に延びる搬送空間を画定する隔壁と、搬送空間に配置され、各処理槽間にて配列方向に沿って基板を搬送する搬送機構と、搬送空間に前記配列方向に沿って延びるように設けられた導風ダクトと、を有する。導風ダクトにはファンフィルタユニットが接続されている。各処理槽には排気ダクトが接続されている。導風ダクトのうち各処理槽と対向する部分にはそれぞれ開口が形成されている。第1処理ユニットの搬送空間と第2処理ユニットの搬送空間とは、隔壁により上下に分離されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)