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1. (WO2019031549) TERMINAL MATERIAL WITH SILVER COATING FILM, AND TERMINAL WITH SILVER COATING FILM
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031549 International Application No.: PCT/JP2018/029780
Publication Date: 14.02.2019 International Filing Date: 08.08.2018
IPC:
C25D 7/00 (2006.01) ,C25D 5/12 (2006.01) ,C25D 5/50 (2006.01) ,H01R 13/03 (2006.01) ,H01R 13/11 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10
Electroplating with more than one layer of the same or of different metals
12
at least one layer being of nickel or chromium
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
50
by heat-treatment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
03
characterised by the material, e.g. plating or coating materials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
10
Sockets for co-operation with pins or blades
11
Resilient sockets
Applicants:
三菱マテリアル株式会社 MITSUBISHI MATERIALS CORPORATION [JP/JP]; 東京都千代田区丸の内三丁目2番3号 2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo 1008117, JP
Inventors:
久保田 賢治 KUBOTA, Kenji; JP
西村 透 NISHIMURA, Tooru; JP
玉川 隆士 TAMAGAWA, Takashi; JP
中矢 清隆 NAKAYA, Kiyotaka; JP
Agent:
青山 正和 AOYAMA, Masakazu; JP
Priority Data:
2017-15362408.08.2017JP
2018-12309728.06.2018JP
Title (EN) TERMINAL MATERIAL WITH SILVER COATING FILM, AND TERMINAL WITH SILVER COATING FILM
(FR) MATÉRIAU DE BORNE DOTÉ DE FILM DE REVÊTEMENT D'ARGENT ET BORNE DOTÉ DE FILM DE REVÊTEMENT D'ARGENT
(JA) 銀皮膜付端子材及び銀皮膜付端子
Abstract:
(EN) This terminal material with a silver coating film, which has a silver layer on the surface, enables the production of a terminal material and a terminal having high reliability at low cost without requiring a heat treatment. According to the present invention, a nickel layer, an intermediate layer and a silver layer are sequentially laminated on a base material, which is formed of copper or a copper alloy, in this order; the nickel layer has a thickness of from 0.05 μm to 5.00 μm (inclusive), and is formed of nickel or a nickel alloy; the intermediate layer has a thickness of from 0.02 μm to 1.00 μm (inclusive), and is formed of an alloy that contains silver (Ag) and a substance X; and the substance X contains one or more elements selected from among tin, bismuth, gallium, indium and germanium.
(FR) Le matériau de borne doté de film de revêtement d'argent selon l'invention, qui comporte une couche d'argent sur la surface, permet de produire un matériau de borne et une borne ayant une fiabilité élevée, pour un coût modique et sans nécessiter un traitement thermique. Selon la présente invention, une couche de nickel, une couche intermédiaire et une couche d'argent sont stratifiées séquentiellement, dans cet ordre, sur un matériau de base formé de cuivre ou d'un alliage de cuivre. La couche de nickel a une épaisseur de 0,05 µm à 5,00 µm (inclus) et elle est formée de nickel ou d'un alliage de nickel; la couche intermédiaire a une épaisseur de 0,02 µm à 1,00 µm (inclus) et elle est formée d'un alliage qui contient de l'argent (Ag) et une substance X; et la substance X contient un ou plusieurs éléments choisis parmi l'étain, le bismuth, le gallium, l'indium et le germanium.
(JA) 表面に銀層を有する銀皮膜付端子材において、熱処理によることなく、信頼性の高い端子および端子材を安価に製造する。 銅又は銅合金からなる基材の上に、ニッケル層、中間層、銀層がこの順に積層されており、前記ニッケル層は厚さが0.05μm以上5.00μm以下であり、ニッケル又はニッケル合金からなり、前記中間層は、厚みが0.02μm以上1.00μm以下であり、銀(Ag)と物質Xとを含む合金であり、前記物質Xが錫、ビスマス、ガリウム、インジウム及びゲルマニウムのうちの一種類以上を含む。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)