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1. (WO2019031533) THERMAL PEELING METHOD FOR MACHINING INSPECTION OBJECTS
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031533 International Application No.: PCT/JP2018/029699
Publication Date: 14.02.2019 International Filing Date: 08.08.2018
IPC:
H01L 21/301 (2006.01) ,C09J 5/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5
Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23番23号 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
阿久津 高志 AKUTSU, Takashi; JP
岡本 直也 OKAMOTO, Naoya; JP
中山 武人 NAKAYAMA, Takehito; JP
Agent:
大谷 保 OHTANI, Tamotsu; JP
有永 俊 ARINAGA, Shun; JP
Priority Data:
2017-15437209.08.2017JP
Title (EN) THERMAL PEELING METHOD FOR MACHINING INSPECTION OBJECTS
(FR) PROCÉDÉ DE PELAGE THERMIQUE POUR L'USINAGE D'OBJETS D'INSPECTION
(JA) 加工検査対象物の加熱剥離方法
Abstract:
(EN) A thermal peeling method for machining inspection objects, the method including steps (I) and (II) below. Step (I): a step for sticking a plurality of machining inspection objects to an adhesive surface of an adhesive layer (X1) of an adhesive sheet that includes the adhesive layer (X1) and a non-adhesive, thermally expandable base material that includes a resin and thermally expandable particles. Step (II): a step for heating a portion of the thermally expandable base material to at least the temperature at which the thermally expandable particles expand and selectively peeling off a portion of the plurality of machining inspection objects.
(FR) L'invention concerne un procédé de pelage thermique pour l'usinage d'objets d'inspection, le procédé comprenant les étapes (I) et (II) ci-dessous. Étape (I) : une étape consistant à coller une pluralité d'objets d'inspection d'usinage à une surface adhésive d'une couche adhésive (X1) d'une feuille adhésive qui comprend la couche adhésive (X1) et un matériau de base non adhésif, thermo-expansible qui comprend une résine et des particules thermo-expansibles. Étape (II) : une étape consistant à chauffer une partie du matériau de base thermo-expansible à au moins la température à laquelle les particules thermo-expansibles se dilatent et décollent sélectivement une partie de la pluralité d'objets d'inspection d'usinage.
(JA) 以下の工程(I)及び(II)を有する、加工検査対象物の加熱剥離方法である。 工程(I):樹脂及び熱膨張性粒子を含む非粘着性の熱膨張性基材と、粘着剤層(X1)と、を有する粘着シートの粘着剤層(X1)の粘着表面に複数個の加工検査対象物を貼着する工程 工程(II):前記熱膨張性基材の一部を前記熱膨張性粒子が膨張する温度以上に加熱して、前記複数個の加工検査対象物のうちの一部を選択的に剥離する工程
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)