Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019031458) LOW-DIELECTRIC-CONSTANT THERMALLY-CONDUCTIVE HEAT DISSIPATION MEMBER
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031458 International Application No.: PCT/JP2018/029456
Publication Date: 14.02.2019 International Filing Date: 06.08.2018
IPC:
H01L 23/36 (2006.01) ,B32B 17/04 (2006.01) ,B32B 27/00 (2006.01) ,B32B 27/20 (2006.01) ,C08J 5/18 (2006.01) ,C08K 3/22 (2006.01) ,C08K 3/28 (2006.01) ,C08L 83/04 (2006.01) ,H01L 23/373 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
17
Layered products essentially comprising sheet glass, or fibres of glass, slag or the like
02
in the form of fibres or filaments
04
bonded with or embedded in a plastic substance
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
18
characterised by the use of special additives
20
using fillers, pigments, thixotroping agents
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
20
Oxides; Hydroxides
22
of metals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
28
Nitrogen-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
Applicants:
デンカ株式会社 DENKA COMPANY LIMITED [JP/JP]; 東京都中央区日本橋室町二丁目1番1号 1-1,Nihonbashi-Muromachi 2-chome,Chuo-ku, Tokyo 1038338, JP
Inventors:
山縣 利貴 YAMAGATA,Toshitaka; JP
和田 光祐 WADA,kosuke; JP
金子 政秀 KANEKO,Masahide; JP
Agent:
アクシス国際特許業務法人 AXIS PATENT INTERNATIONAL; 東京都港区新橋二丁目6番2号 新橋アイマークビル Shimbashi i-mark Bldg., 6-2 Shimbashi 2-Chome, Minato-ku, Tokyo 1050004, JP
Priority Data:
2017-15553510.08.2017JP
Title (EN) LOW-DIELECTRIC-CONSTANT THERMALLY-CONDUCTIVE HEAT DISSIPATION MEMBER
(FR) ÉLÉMENT DE DISSIPATION DE CHALEUR THERMOCONDUCTEUR À FAIBLE CONSTANTE DIÉLECTRIQUE
(JA) 低誘電率熱伝導性放熱部材
Abstract:
(EN) Provided is a heat dissipation member which has excellent thermal conductivity and dielectric properties, and which is particularly preferable as a heat dissipation member for an electronic component. This heat dissipation member is in the form of a sheet having a thickness of 0.1-0.5 mm, and includes a resin composition which contains 60-70 vol% of a thermally-conductive filler containing an aggregated powder of hexagonal boron nitride having an average particle size of 10-20 μm and an orientation index, as defined herein, of 2-20, and an aluminum oxide powder having an average particle size of 3-7 μm, and 30-40 vol% of a silicone resin. The orientation index is the ratio (I002/I100) of the intensity I002 of diffracted beams of the (002) plane to the intensity I100 of diffracted beams of the (100) plane in powder X-ray diffractometry.
(FR) L'invention concerne un élément de dissipation de chaleur qui présente d'excellentes propriétés de conductivité thermique et diélectrique, et qui est particulièrement préférable en tant qu'élément de dissipation de chaleur pour un composant électronique. Cet élément de dissipation de chaleur se présente sous la forme d'une feuille ayant une épaisseur de 0,1 à 0,5 mm, et comprend une composition de résine qui contient 60 à 70 % en volume d'une charge thermoconductrice contenant une poudre agrégée de nitrure de bore hexagonal ayant une taille de particule moyenne de 10 à 20 µm et un indice d'orientation, tel que définie dans la description, de 2 à 20, et une poudre d'oxyde d'aluminium ayant une taille de particule moyenne de 3 à 7 µm, et 30 à 40 % en volume d'une résine de silicone. L'indice d'orientation est le rapport (I002/I100) de l'intensité I002 de faisceaux diffractés du plan (002) à l'intensité I100 de faisceaux diffractés du plan (100) dans la diffractométrie des rayons X sur poudre.
(JA) 熱伝導性と誘電性に優れ、特に電子部品用放熱部材として好適な放熱部材を提供する。平均粒子径10~20μm、下記で定義された配向性指数が2~20の六方晶窒化ホウ素の凝集粉末と平均粒子径3~7μmの酸化アルミニウム粉末とを含んだ熱伝導性フィラー60~70体積%と、シリコーン樹脂30~40体積%とを含有した樹脂組成物を含んだ、厚さ0.1~0.5mmのシート状の放熱部材。 配向性指数は、粉末X線回折法による(002)面の回折線の強度I002と(100)面の回折線の強度I100との比(I002/I100)である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)