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1. (WO2019031400) METHOD FOR PRODUCING WIRING BOARD
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031400 International Application No.: PCT/JP2018/029171
Publication Date: 14.02.2019 International Filing Date: 03.08.2018
IPC:
G06F 3/041 (2006.01) ,G06F 3/044 (2006.01) ,H05K 3/10 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
044
by capacitive means
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
Applicants:
シャープ株式会社 SHARP KABUSHIKI KAISHA [JP/JP]; 大阪府堺市堺区匠町1番地 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522, JP
Inventors:
野間 幹弘 NOMA Mikihiro; --
吉良 隆敏 KIRA Takatoshi; --
Agent:
特許業務法人暁合同特許事務所 AKATSUKI UNION PATENT FIRM; 愛知県名古屋市中区栄二丁目1番1号 日土地名古屋ビル5階 5th Floor, Nittochi Nagoya Bldg., 1-1, Sakae 2-chome, Naka-ku, Nagoya-shi, Aichi 4600008, JP
Priority Data:
2017-15574510.08.2017JP
Title (EN) METHOD FOR PRODUCING WIRING BOARD
(FR) PROCÉDÉ DE PRODUCTION D'UNE CARTE DE CÂBLAGE
(JA) 配線基板の製造方法
Abstract:
(EN) According to the present invention, a method for producing a touch panel 20 comprises: a step for forming a first imprint layer 25; a step for forming a first wiring line formation groove part 27; a step for forming a first wiring line 28; a step for forming a spacer layer 33 that is arranged to be superposed on a surface of the first imprint layer 25, in which the first wiring line formation groove part 27 is formed, and overlaps with a part of the first wiring line 28; a step for forming a second imprint layer 26 such that the spacer layer 33 is interposed between the second imprint layer 26 and the first imprint layer 25; a step for forming a second wiring line formation groove part 29; a step for forming a second wiring line 30; and a step for separating the spacer layer 33 from the first imprint layer 25 so as to remove a portion of the second imprint layer 26 together with the separated portion of the spacer layer 33, said portion of the second imprint layer 26 overlapping with the separated portion.
(FR) La présente invention concerne un procédé de production d'un panneau tactile (20) qui comprend : une étape consistant à former une première couche d'impression (25); une étape consistant à former une première partie de rainure de formation de ligne de câblage (27); une étape consistant à former une première ligne de câblage (28); une étape consistant à former une couche d'espacement (33) qui est agencée pour être superposée sur une surface de la première couche d'impression (25), dans laquelle la première partie de rainure de formation de ligne de câblage (27) est formée, et chevauche une partie de la première ligne de câblage (28); une étape consistant à former une seconde couche d'impression (26) de telle sorte que la couche d'espacement (33) est interposée entre la seconde couche d'impression (26) et la première couche d'impression (25); une étape consistant à former une seconde partie de rainure de formation de ligne de câblage (29); une étape consistant à former une seconde ligne de câblage (30) ; et une étape consistant à séparer la couche d'espacement (33) de la première couche d'impression (25) de façon à retirer une partie de la seconde couche d'impression (26) avec la partie séparée de la couche d'espacement (33), ladite partie de la seconde couche d'impression (26) chevauchant la partie séparée.
(JA) タッチパネル20の製造方法は、第1インプリント層25を形成する工程と、第1配線形成溝部27を形成する工程と、第1配線28を形成する工程と、第1インプリント層25における第1配線形成溝部27の形成面に対して重なるよう配されて第1配線28の一部と重畳するスペーサ層33を形成する工程と、第1インプリント層25との間にスペーサ層33が介在する第2インプリント層26を形成する工程と、第2配線形成溝部29を形成する工程と、第2配線30を形成する工程と、スペーサ層33を第1インプリント層25から剥離し、その剥離部分と共に第2インプリント層26のうちの剥離部分と重畳する部分を除去する工程と、を含む。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)