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1. (WO2019031393) CONDUCTIVE ADHESIVE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031393 International Application No.: PCT/JP2018/029109
Publication Date: 14.02.2019 International Filing Date: 02.08.2018
IPC:
C09J 163/00 (2006.01) ,C09J 7/35 (2018.01) ,C09J 9/02 (2006.01) ,C09J 11/04 (2006.01) ,C09J 11/06 (2006.01) ,C09J 175/04 (2006.01) ,H05K 1/02 (2006.01) ,H05K 9/00 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
[IPC code unknown for C09J 7/35]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
175
Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
04
Polyurethanes
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
タツタ電線株式会社 TATSUTA ELECTRIC WIRE & CABLE CO., LTD. [JP/JP]; 大阪府東大阪市岩田町2丁目3番1号 3-1, Iwata-cho 2-chome, Higashiosaka-shi, Osaka 5788585, JP
Inventors:
青柳 慶彦 AOYAGI Yoshihiko; JP
磯部 修 ISOBE Osamu; JP
上農 憲治 KAMINO Kenji; JP
Agent:
特許業務法人前田特許事務所 MAEDA & PARTNERS; 大阪府大阪市北区堂島浜1丁目2番1号 新ダイビル23階 Shin-Daibiru Bldg. 23F, 2-1, Dojimahama 1-chome, Kita-ku, Osaka-shi, Osaka 5300004, JP
Priority Data:
2017-15247907.08.2017JP
Title (EN) CONDUCTIVE ADHESIVE
(FR) ADHÉSIF CONDUCTEUR
(JA) 導電性接着剤
Abstract:
(EN) A conductive adhesive including a thermosetting resin (A), a conductive filler (B), and an embeddability improver (C). The thermosetting resin (A) includes a first resin component (A1) having a first functional group and a second resin component (A2) having a second functional group that reacts to the first functional group. The embeddability improver (C) comprises an organic salt and is 40–140 parts by mass relative to 100 parts by mass of thermosetting resin.
(FR) L'invention concerne un adhésif conducteur comprenant une résine thermodurcissable (A), une charge conductrice (B) et un améliorant d'incorporation (C). La résine thermodurcissable (A) comprend un premier constituant de résine (A1) ayant un premier groupe fonctionnel et un second constituant de résine (A2) ayant un second groupe fonctionnel qui réagit au premier groupe fonctionnel. L'améliorant d'incorporation (C) comprend un sel organique et représente 40 à 140 parties en masse par rapport à 100 parties en masse de résine thermodurcissable.
(JA) 導電性接着剤は、熱硬化性樹脂(A)と、導電性フィラー(B)と、埋め込み性改善剤(C)とを含んでいる。熱硬化性樹脂(A)は、第1の官能基を有する第1樹脂成分(A1)と、第1の官能基と反応する第2の官能基を有する第2樹脂成分(A2)とを含み、埋め込み性改善剤(C)は、有機塩からなり、熱硬化性樹脂100質量部に対し、40質量部以上、140質量部以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)