Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019031392) SCANNING ANTENNA AND METHOD FOR PRODUCING SCANNING ANTENNA
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031392 International Application No.: PCT/JP2018/029107
Publication Date: 14.02.2019 International Filing Date: 02.08.2018
IPC:
H01P 11/00 (2006.01) ,H01Q 3/34 (2006.01) ,H01Q 3/44 (2006.01) ,H01Q 13/22 (2006.01) ,H01Q 21/06 (2006.01) ,H05K 1/09 (2006.01) ,H05K 1/16 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
11
Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
3
Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an aerial or aerial system
26
varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
30
varying the phase
34
by electrical means
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
3
Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an aerial or aerial system
44
varying the electric or magnetic characteristics of reflecting, refracting, or diffracting devices associated with the radiating element
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
13
Waveguide horns or mouths; Slot aerials; Leaky-waveguide aerials; Equivalent structures causing radiation along the transmission path of a guided wave
20
Non-resonant leaky-waveguide or transmission-line aerials; Equivalent structures causing radiation along the transmission path of a guided wave
22
Longitudinal slot in boundary wall of waveguide or transmission line
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
21
Aerial arrays or systems
06
Arrays of individually energised aerial units similarly polarised and spaced apart
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
16
incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Applicants:
シャープ株式会社 SHARP KABUSHIKI KAISHA [JP/JP]; 大阪府堺市堺区匠町1番地 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522, JP
Inventors:
美崎 克紀 MISAKI Katsunori; --
Agent:
奥田 誠司 OKUDA Seiji; JP
Priority Data:
2017-15427109.08.2017JP
Title (EN) SCANNING ANTENNA AND METHOD FOR PRODUCING SCANNING ANTENNA
(FR) ANTENNE DE BALAYAGE ET PROCÉDÉ DE FABRICATION D'UNE ANTENNE DE BALAYAGE
(JA) 走査アンテナおよび走査アンテナの製造方法
Abstract:
(EN) This method for producing a scanning antenna produces a scanning antenna in which a plurality of antenna units are arranged, and which comprises: a TFT substrate that comprises a first dielectric substrate, a TFT, a gate bus line, a source bus line and a plurality of patch electrodes; a slot substrate that comprises a second dielectric substrate (51) and a slot electrode (55) having a plurality of slots (57) that are arranged so as to correspond to the plurality of patch electrodes; a liquid crystal layer; and a reflective conductive plate. This method for producing a scanning antenna comprises: a step (a) wherein a first conductive film (55a') containing copper is deposited on a first main surface of the second dielectric substrate; a step (b) wherein an oxide film (55o') is formed in the surface of the first conductive film by bringing the first conductive film into contact with the atmosphere after the step (a); and a step (c) wherein a second conductive film (55b') containing copper is deposited on the oxide film after the step (b).
(FR) L'invention concerne un procédé de fabrication d'une antenne de balayage qui fabrique une antenne de balayage dans laquelle sont agencées une pluralité d'unités d'antenne, et qui comprend : un substrat de transistor à couches minces qui comprend un premier substrat diélectrique, un transistor à couches minces, une ligne de bus de grille, une ligne de bus de source et une pluralité d'électrodes à plaques ; un substrat à fentes qui comprend un second substrat diélectrique (51) et une électrode à fentes (55) possédant une pluralité de fentes (57) qui sont agencées de façon à correspondre à la pluralité d'électrodes à plaques ; une couche de cristaux liquides ; et une plaque conductrice réfléchissante. Ce procédé de fabrication d'une antenne de balayage comprend : une étape (a) dans laquelle un premier film conducteur (55a') contenant du cuivre est déposé sur une première surface principale du second substrat diélectrique ; une étape (b) dans laquelle un film d'oxyde (55o') est formé dans la surface du premier film conducteur en amenant le premier film conducteur en contact avec l'atmosphère après l'étape (a) ; et une étape (c) dans laquelle un second film conducteur (55b') contenant du cuivre est déposé sur le film d'oxyde après l'étape (b).
(JA) 走査アンテナの製造方法は、複数のアンテナ単位が配列された走査アンテナであって、第1誘電体基板と、TFTと、ゲートバスラインと、ソースバスラインと、複数のパッチ電極とを有するTFT基板と、第2誘電体基板(51)と、複数のパッチ電極に対応して配置された複数のスロット(57)を有するスロット電極(55)とを有するスロット基板と、液晶層と、反射導電板とを有する走査アンテナの製造方法であって、第2誘電体基板の第1主面上に、銅を含む第1導電膜(55a')を堆積する工程(a)と、工程(a)の後に、第1導電膜を大気に接触させることによって、第1導電膜の表面に酸化膜(55o')を形成する工程(b)と、工程(b)の後に、酸化膜上に、銅を含む第2導電膜(55b')を堆積する工程(c)とを包含する。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)