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1. (WO2019031303) FLUID SUPPLY DEVICE AND FLUID SUPPLY METHOD
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031303 International Application No.: PCT/JP2018/028601
Publication Date: 14.02.2019 International Filing Date: 31.07.2018
IPC:
H01L 21/304 (2006.01) ,H01L 21/027 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
Applicants:
株式会社フジキン FUJIKIN INCORPORATED [JP/JP]; 大阪府大阪市西区立売堀2丁目3番2号 3-2, Itachibori 2-chome, Nishi-ku, Osaka-city Osaka 5500012, JP
Inventors:
吉田 俊英 YOSHIDA Toshihide; JP
皆見 幸男 MINAMI Yukio; JP
篠原 努 SHINOHARA Tsutomu; JP
Agent:
藤本 健司 FUJIMOTO Kenji; JP
Priority Data:
2017-15619310.08.2017JP
Title (EN) FLUID SUPPLY DEVICE AND FLUID SUPPLY METHOD
(FR) DISPOSITIF ET PROCÉDÉ DE DISTRIBUTION DE FLUIDE
(JA) 流体供給装置および流体供給方法
Abstract:
(EN) [Problem] To provide a fluid supply device and a fluid supply method that make it possible to stably supply a supercritical fluid. [Solution] A fluid supply device that: supplies a fluid that is in a pre–supercritical fluid transformation liquid state toward a processing chamber; and has a condenser 130 that condenses and liquefies a gaseous fluid, a tank 140 that stores fluid that has been condensed and liquefied by the condenser 130, a pump 150 that pressure-feeds the liquefied fluid that is stored in the tank 140 toward the processing chamber 500, and a heating 20 means that is provided on a flow path that communicates with a discharge side of the pump 150, and is for turning a portion of fluid in the flow path into a supercritical fluid.
(FR) Le problème décrit par la présente invention est de fournir un dispositif de distribution de fluide et un procédé de distribution de fluide qui permettent de distribuer de manière stable un fluide supercritique. La solution de l'invention porte sur un dispositif de distribution de fluide qui : distribue un fluide qui est dans un état liquide de transformation de fluide pré-supercritique vers une chambre de traitement ; et comporte un condenseur 130 qui condense et liquéfie un fluide gazeux, un réservoir 140 qui stocke un fluide qui a été condensé et liquéfié par le condenseur 130, une pompe 150 qui introduit par pression le fluide liquéfié qui est stocké dans le réservoir 140 dans la chambre de traitement 500, et un moyen de chauffage 20 qui est disposé sur un trajet d'écoulement qui communique avec un côté d'évacuation de la pompe 150, et qui est destiné à transformer une partie du fluide dans le trajet d'écoulement en fluide supercritique.
(JA) 【課題】超臨界流体を安定的に供給可能な流体供給装置および流体供給方法を提供する。 【解決手段】超臨界流体へ変化させる前の液体状態の流体を処理室に向けて供給する流体供給装置であって、気体状態の流体を凝縮液化するコンデンサ130と、コンデンサ130により凝縮液化された流体を貯留するタンク140と、タンク140に貯留された液化された流体を処理室500へ向けて圧送するポンプ150と、ポンプ150の吐出側と連通する流路に設けられ、当該流路内の液体を部分的に超臨界流体にするための加熱手段20と、を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)