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1. (WO2019031194) ADHESIVE, ELECTRONIC DEVICE AND OPTICAL DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031194 International Application No.: PCT/JP2018/027214
Publication Date: 14.02.2019 International Filing Date: 20.07.2018
IPC:
C09J 201/00 (2006.01) ,C09J 11/08 (2006.01) ,H01L 21/52 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
08
Macromolecular additives
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
Applicants:
ソニー株式会社 SONY CORPORATION [JP/JP]; 東京都港区港南1丁目7番1号 1-7-1 Konan, Minato-ku, Tokyo 1080075, JP
Inventors:
三星 正彦 MITSUBOSHI, Masahiko; JP
稲津 元久 INADU, Motohisa; JP
Agent:
大森 純一 OMORI, Junichi; JP
Priority Data:
2017-15319108.08.2017JP
Title (EN) ADHESIVE, ELECTRONIC DEVICE AND OPTICAL DEVICE
(FR) ADHÉSIF, DISPOSITIF ÉLECTRONIQUE ET DISPOSITIF OPTIQUE
(JA) 接着剤、電子機器及び光学機器
Abstract:
(EN) [Problem] To provide: an adhesive which is suitable for bonding constituent parts of an electronic device or an optical device; and an electronic device and an optical device, each of which uses this adhesive. [Solution] An adhesive according to the present technique is provided with an adhesive material and a plurality of particles. The adhesive material is flexible. The plurality of particles are dispersed in the adhesive material; and the particles deform when a low-speed load is applied thereto, but do not deform when a high-speed load is applied thereto.
(FR) Le problème décrit par la présente invention est de fournir : un adhésif qui est approprié pour lier des parties constitutives d'un dispositif électronique ou d'un dispositif optique ; et un dispositif électronique et un dispositif optique, chacun utilisant ledit adhésif. La solution selon la présente invention porte sur un adhésif qui est pourvu d'un matériau adhésif et d'une pluralité de particules. Le matériau adhésif est souple. La pluralité de particules sont dispersées dans le matériau adhésif ; et les particules se déforment lorsqu'une charge à faible vitesse est appliquée à ces dernières, mais ne se déforment pas lorsqu'une charge à grande vitesse est appliquée à ces dernières.
(JA) 【課題】電子機器や光学機器の構成部品の接着に適する接着剤及び当該接着剤を用いた電子機器及び光学機器を提供すること。 【解決手段】本技術に係る接着剤は、接着材料と、複数の粒子とを具備する。上記接着材料は柔軟性を有する。上記複数の粒子は、上記接着材料に分散され、低速負荷を受けると変形し、高速負荷を受けると変形しない。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)