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1. (WO2019031183) SEMICONDUCTOR MODULE, DISPLAY DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031183 International Application No.: PCT/JP2018/027076
Publication Date: 14.02.2019 International Filing Date: 19.07.2018
IPC:
H01L 33/48 (2010.01) ,B23K 26/57 (2014.01) ,G09F 9/30 (2006.01) ,H01L 33/08 (2010.01) ,H01L 33/22 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
[IPC code unknown for B23K 26/57]
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
F
DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9
Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30
in which the desired character or characters are formed by combining individual elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
characterised by the semiconductor bodies
08
with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
characterised by the semiconductor bodies
20
with a particular shape, e.g. curved or truncated substrate
22
Roughened surfaces, e.g. at the interface between epitaxial layers
Applicants:
シャープ株式会社 SHARP KABUSHIKI KAISHA [JP/JP]; 大阪府堺市堺区匠町1番地 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522, JP
Inventors:
大沼 宏彰 ONUMA, Hiroaki; --
小野 高志 ONO, Takashi; --
東坂 浩由 HIGASHISAKA, Hiroyoshi; --
小野 剛史 ONO, Tsuyoshi; --
栗栖 崇 KURISU, Takashi; --
幡 俊雄 HATA, Toshio; --
Agent:
特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK; 大阪府大阪市北区天神橋2丁目北2番6号 大和南森町ビル Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041, JP
Priority Data:
2017-15590410.08.2017JP
2017-20560024.10.2017JP
Title (EN) SEMICONDUCTOR MODULE, DISPLAY DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE
(FR) MODULE À SEMI-CONDUCTEURS, DISPOSITIF D'AFFICHAGE ET PROCÉDÉ DE FABRICATION DE MODULE À SEMI-CONDUCTEURS
(JA) 半導体モジュール、表示装置、及び半導体モジュールの製造方法
Abstract:
(EN) This semiconductor module (1) comprises: a base substrate (11) which is provided with a drive circuit (11a); and a plurality of light emitting elements (15) which are electrically connected to the drive circuit (11a). The distance between light emitting elements (15) adjacent to each other is 20 μm or less in a top view.
(FR) La présente invention concerne un module à semi-conducteurs (1), comprenant : un substrat de base (11) pourvu d'un circuit d'attaque (11a); et une pluralité d'éléments électroluminescents (15) qui sont électriquement connectés au circuit d'attaque (11a). La distance entre les éléments électroluminescents (15) adjacents les uns aux autres est inférieure ou égale à 20 µm en vue de dessus.
(JA) 半導体モジュール(1)は、駆動回路(11a)が形成された下地基板(11)と、駆動回路(11a)と電気的に接続された、複数の発光素子(15)とを備え、互いに隣接する発光素子(15)間の距離は、上面視において、20μm以下である。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)