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1. (WO2019031114) POLYMER, RESIN COMPOSITION, RESIN FILM, METHOD FOR PRODUCING PATTERNED RESIN FILM, AND ELECTRONIC COMPONENT
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031114 International Application No.: PCT/JP2018/025282
Publication Date: 14.02.2019 International Filing Date: 03.07.2018
IPC:
C08L 101/06 (2006.01) ,C08F 212/14 (2006.01) ,G03F 7/023 (2006.01) ,G03F 7/038 (2006.01) ,G03F 7/075 (2006.01) ,G03F 7/20 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
02
characterised by the presence of specified groups
06
containing oxygen atoms
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
212
Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
02
Monomers containing only one unsaturated aliphatic radical
04
containing one ring
14
substituted by hetero atoms or groups containing hetero atoms
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
022
Quinonediazides
023
Macromolecular quinonediazides; Macromolecular additives, e.g. binders
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
038
Macromolecular compounds which are rendered insoluble or differentially wettable
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
075
Silicon-containing compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
Applicants:
JSR株式会社 JSR CORPORATION [JP/JP]; 東京都港区東新橋一丁目9番2号 9-2, Higashi-Shinbashi 1-chome, Minato-ku, Tokyo 1058640, JP
Inventors:
下川 努 SHIMOKAWA Tsutomu; JP
杉浦 誠 SUGIURA Makoto; JP
土井 貴史 DOI Takashi; JP
Agent:
特許業務法人SSINPAT SSINPAT PATENT FIRM; 東京都品川区西五反田七丁目13番6号 五反田山崎ビル6階 Gotanda Yamazaki Bldg. 6F, 13-6, Nishigotanda 7-chome, Shinagawa-ku, Tokyo 1410031, JP
Priority Data:
2017-15565410.08.2017JP
2018-04953216.03.2018JP
Title (EN) POLYMER, RESIN COMPOSITION, RESIN FILM, METHOD FOR PRODUCING PATTERNED RESIN FILM, AND ELECTRONIC COMPONENT
(FR) POLYMÈRE, COMPOSITION DE RÉSINE, FILM DE RÉSINE, PROCÉDÉ DE PRODUCTION DE FILM DE RÉSINE À MOTIFS, ET COMPOSANT ÉLECTRONIQUE
(JA) 重合体、樹脂組成物、樹脂膜、パターン化樹脂膜の製造方法、および電子部品
Abstract:
(EN) [Problem] To provide a resin composition which has excellent heat resistance. [Solution] A resin composition which contains: a polymer that contains, in one same molecule or in different molecules, a structural unit having a partial structure of formula (i) and one or more structural units selected from among structural units having a partial structure of formula (ii-1) and structural units having a phenolic hydroxyl group; and a solvent. In the formulae, each of R1 and R2 independently represents a hydrogen atom, a hydrocarbon group having 1-20 carbon atoms, a group that has at least one moiety selected from among -O- and the like in at least one carbon-carbon bond in the above-described hydrocarbon group, or a group that is obtained by substituting some hydrogen atoms in these groups; R1 and R2 may combine with each other and form a cyclic structure having 3-20 ring members together with B to which OR1 and OR2 are bonded; each of R3 and R4 independently represents a hydrogen atom, a hydrocarbon group having 1-20 carbon atoms or an electron-withdrawing group; at least one of R3 and R4 represents an electron-withdrawing group; and * represents a bonding hand.
(FR) Le problème décrit par la présente invention est de fournir une composition de résine qui présente une excellente résistance à la chaleur. La solution selon l'invention porte sur une composition de résine qui contient : un polymère qui contient, dans une même molécule ou dans différentes molécules, un motif structural ayant une structure partielle de formule (i) et un ou plusieurs motifs structuraux choisis parmi des motifs structuraux ayant une structure partielle de formule (ii-1) et des motifs structuraux ayant un groupe hydroxyle phénolique ; et un solvant. Dans les formules, chacun de R1 et R2 représente indépendamment un atome d'hydrogène, un groupe hydrocarboné ayant de 1 à 20 atomes de carbone, un groupe qui a au moins une fraction choisie parmi -O- et similaire dans au moins une liaison carbone-carbone dans le groupe hydrocarboné décrit ci-dessus, ou un groupe qui est obtenu par substitution de certains atomes d'hydrogène dans ces groupes ; R1 et R2 peuvent se combiner les uns avec les autres et former une structure cyclique ayant de 3 à 20 chaînons cycliques conjointement avec B auquel OR1 et OR2 sont liés ; chacun de R3 et R4 représente indépendamment un atome d'hydrogène, un groupe hydrocarboné ayant de 1 à 20 atomes de carbone ou un groupe attracteur d'électrons ; au moins l'un de R3 et R4 représente un groupe attracteur d'électrons ; et * représente un bras de liaison.
(JA) [課題]耐熱性に優れた樹脂組成物を提供する。 [解決手段]同一のまたは異なる分子中に、式(i)の部分構造を有する構造単位と、式(ii-1)の部分構造を有する構造単位、およびフェノール性水酸基を有する構造単位から選択される一以上の構造単位とを含む重合体、ならびに溶媒を含有する樹脂組成物。 R1、R2は、各々独立に水素原子、炭素数1~20の炭化水素基、該炭化水素基中の少なくとも1つの炭素-炭素結合間に-O-等から選ばれる少なくとも一種を有する基、またはこれらの基中の水素原子の一部が置換された基であり、R1、R2は、相互に結合してOR1およびOR2が結合するBと共に環員数3~20の環状構造を形成してもよい。R3、R4は、各々独立に水素原子、炭素数1~20の炭化水素基、または電子求引性基であり、R3、R4のうち少なくともいずれかは電子求引性基である。*は結合手を示す。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)