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1. (WO2019031082) ORGANOSILICON COMPOUND AND THERMOSETTING HEAT CONDUCTIVE SILICONE COMPOSITION
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031082 International Application No.: PCT/JP2018/023903
Publication Date: 14.02.2019 International Filing Date: 22.06.2018
IPC:
C07F 7/18 (2006.01) ,C08K 5/5415 (2006.01) ,C08K 5/5425 (2006.01) ,C08L 83/05 (2006.01) ,C08L 83/07 (2006.01)
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
F
ACYCLIC, CARBOCYCLIC, OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
7
Compounds containing elements of the 4th Group of the Periodic System
02
Silicon compounds
08
Compounds having one or more C-Si linkages
18
Compounds having one or more C-Si linkages as well as one or more C-O-Si linkages
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
541
containing oxygen
5415
containing at least one Si-O bond
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
541
containing oxygen
5425
containing at least one CC bond
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
Applicants:
信越化学工業株式会社 SHIN-ETSU CHEMICAL CO.,LTD. [JP/JP]; 東京都千代田区大手町二丁目6番1号 6-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo 1000004, JP
Inventors:
石原 靖久 ISHIHARA Yasuhisa; JP
深町 匠 FUKAMACHI Takumi; JP
小材 利之 OZAI Toshiyuki; JP
遠藤 晃洋 ENDO Akihiro; JP
Agent:
好宮 幹夫 YOSHIMIYA Mikio; JP
小林 俊弘 KOBAYASHI Toshihiro; JP
Priority Data:
2017-15615710.08.2017JP
Title (EN) ORGANOSILICON COMPOUND AND THERMOSETTING HEAT CONDUCTIVE SILICONE COMPOSITION
(FR) COMPOSÉ D'ORGANOSILICIUM ET COMPOSITION DE SILICONE THERMOCONDUCTRICE THERMODURCISSABLE
(JA) 有機ケイ素化合物及び硬化性熱伝導性シリコーン組成物
Abstract:
(EN) The present invention is an organosilicon compound which is represented by general formula (1). Consequently, the present invention provides an organosilicon compound that is used in a thermosetting heat conductive silicone composition which is able to be highly filled with a heat conductive filler, and which is able to be suppressed in decrease in the strength even in cases where the thermosetting heat conductive silicone composition is highly filled with a heat conductive filler. (In the formula, R1 represents an alkyl group having 1-6 carbon atoms; R2 independently represents a hydrogen atom or an unsubstituted or substituted monovalent hydrocarbon group; each of R3 and R4 independently represents an unsubstituted or substituted monovalent hydrocarbon group; R5 represents a hydrogen atom or an alkenyl group; m represents an integer of 1-30; and n represents an integer of 3 or 4.)
(FR) La présente invention porte sur un composé d'organosilicium représenté par la formule générale (1). La présente invention concerne un composé d'organosilicium utilisé dans une composition de silicone thermoconductrice thermodurcissable qui peut être fortement remplie d'une charge thermoconductrice, et qui peut être supprimée dans la diminution de la résistance même dans les cas où la composition de silicone thermoconductrice thermodurcissable est fortement remplie d'une charge thermoconductrice. (Dans la formule, R1 représente un groupe alkyle ayant de 1 à 6 atomes de carbone ; R2 représente indépendamment un atome d'hydrogène ou un groupe hydrocarboné monovalent substitué ou non substitué ; chacun de R3 et R4 représente indépendamment un groupe hydrocarboné monovalent substitué ou non substitué ; R5 représente un atome d'hydrogène ou un groupe alcényle ; m représente un nombre entier de 1 à 30 ; et n représente un nombre entier de 3 ou 4.)
(JA) 本発明は、下記一般式(1)で表される有機ケイ素化合物である。これにより、熱伝導性充填材を高充填することができ、更に熱伝導性充填材を高充填した場合にも硬化性熱伝導性シリコーン組成物の強度低下を抑えることができる硬化性熱伝導性シリコーン組成物に用いられる有機ケイ素化合物が提供される。(式中、Rは炭素原子数が1~6のアルキル基であり、Rは独立に水素原子又は、非置換若しくは置換の1価の炭化水素基であり、R及びRはそれぞれ独立に非置換若しくは置換の1価の炭化水素基であり、Rは水素原子又はアルケニル基であり、mは1~30の整数、nは3~4の整数である。)
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)