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1. (WO2019031072) INPUT DEVICE MANUFACTURING METHOD AND INPUT DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031072 International Application No.: PCT/JP2018/023487
Publication Date: 14.02.2019 International Filing Date: 20.06.2018
IPC:
G06F 3/041 (2006.01) ,G06F 3/044 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
044
by capacitive means
Applicants:
アルプスアルパイン株式会社 ALPS ALPINE CO., LTD. [JP/JP]; 東京都大田区雪谷大塚町1番7号 1-7, Yukigaya-otsukamachi, Ota-ku, Tokyo 1458501, JP
Inventors:
橋田 淳二 HASHIDA, Junji; JP
Agent:
大窪 克之 OKUBO, Katsuyuki; JP
Priority Data:
2017-15304108.08.2017JP
Title (EN) INPUT DEVICE MANUFACTURING METHOD AND INPUT DEVICE
(FR) PROCÉDÉ DE FABRICATION DE DISPOSITIF D'ENTRÉE ET DISPOSITIF D'ENTRÉE
(JA) 入力装置の製造方法および入力装置
Abstract:
(EN) The input device manufacturing method relating to one embodiment of the present invention is provided with a lamination step for: preparing a first base material formed in a flat board shape using a translucent synthetic resin, a second base material formed in a flat board shape using a translucent synthetic resin, and a sensor film wherein a translucent electrode is formed in a translucent resin film; and constituting a flat board-shaped laminated body wherein the sensor film is sandwiched between the first base material and the second base material. The input device manufacturing method is also provided with a bending step for bending the flat board-shaped laminated body, and constituting a bent-shaped laminated body maintaining a bent shape. Consequently, sufficient adhesion between the base materials and the sensor film can be ensured, and high detection accuracy can be obtained by means of the sensor film.
(FR) Selon un mode de réalisation, la présente invention concerne un procédé de fabrication de dispositif d'entrée qui est pourvu d'une étape de stratification pour : préparer un premier matériau de base ayant la forme d'un panneau plat à l'aide d'une résine synthétique translucide, un second matériau de base ayant la forme d'un panneau plat à l'aide d'une résine synthétique translucide, et un film de capteur dans lequel une électrode translucide est formée dans un film de résine translucide; et constituer un corps stratifié en forme de panneau plat, le film de capteur étant pris en sandwich entre le premier matériau de base et le second matériau de base. Le procédé de fabrication de dispositif d'entrée est également pourvu d'une étape de pliage pour plier le corps stratifié en forme de plaque plate, et constituer un corps stratifié de forme courbée maintenant une forme courbée. Par conséquent, une adhérence suffisante entre les matériaux de base et le film de capteur peut être assurée, et une précision de détection élevée peut être obtenue au moyen du film de capteur.
(JA) 本発明の一態様に係る入力装置の製造方法は、透光性の合成樹脂で平板状に形成された第1基材と、透光性の合成樹脂で平板状に形成された第2基材と、透光性の樹脂フィルムに透光性の電極が形成されたセンサフィルムとを用意し、第1基材と第2基材との間にセンサフィルムを挟持した平板状積層体を構成する積層工程と、平板状積層体を湾曲させて、湾曲形状を維持した湾曲状積層体を構成する湾曲工程と、を備えるため、基材とセンサフィルムとの十分な密着性を確保でき、センサフィルムによる高い検出精度を得ることができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)