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1. (WO2019031071) HIGH-FREQUENCY PRINTED CIRCUIT BOARD BASE MATERIAL
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/031071 International Application No.: PCT/JP2018/023409
Publication Date: 14.02.2019 International Filing Date: 20.06.2018
IPC:
H05K 1/03 (2006.01) ,B32B 15/08 (2006.01) ,B32B 15/082 (2006.01) ,B32B 15/20 (2006.01) ,B32B 27/20 (2006.01) ,B32B 27/30 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
082
comprising vinyl resins; comprising acrylic resins
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
20
comprising aluminium or copper
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
18
characterised by the use of special additives
20
using fillers, pigments, thixotroping agents
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
30
comprising vinyl resin; comprising acrylic resin
Applicants:
住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜四丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
住友電工プリントサーキット株式会社 SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. [JP/JP]; 滋賀県甲賀市水口町ひのきが丘30番地 30, Hinokigaoka, Minakuchi-cho, Koka-shi, Shiga 5280068, JP
Inventors:
改森 信吾 KAIMORI, Shingo; JP
山内 雅晃 YAMAUCHI, Masaaki; JP
岡本 健太郎 OKAMOTO, Kentaro; JP
木谷 聡志 KIYA, Satoshi; JP
村田 和夫 MURATA, Kazuo; JP
Agent:
特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.; 大阪府大阪市北区中之島三丁目2番4号 中之島フェスティバルタワー・ウエスト Nakanoshima Festival Tower West, 2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka 5300005, JP
Priority Data:
2017-15372108.08.2017JP
Title (EN) HIGH-FREQUENCY PRINTED CIRCUIT BOARD BASE MATERIAL
(FR) MATÉRIAU DE BASE DE CARTE DE CIRCUITS IMPRIMÉS HAUTE FRÉQUENCE
(JA) 高周波プリント配線板用基材
Abstract:
(EN) In a first embodiment, the high-frequency printed circuit board base material comprises a dielectric layer containing a fluorine resin and an inorganic filler and a copper foil layered on at least one surface of the dielectric layer. In the high-frequency printed circuit board base material, the maximum height roughness (Rz) is 2 μm or less for the surface on the dielectric layer side of the copper foil, and, in the surface layer region on the copper foil side of the dielectric layer, the ratio of the number of inorganic atoms in the inorganic filler with respect to the number of fluorine atoms in the fluorine resin is 0.08 or less.
(FR) La présente invention concerne, dans un premier mode de réalisation, le matériau de base de carte de circuits imprimés haute fréquence qui consiste en une couche diélectrique contenant une résine fluorée et en une charge inorganique et une feuille de cuivre multicouche sur au moins une surface de la couche diélectrique. Dans le matériau de base de la carte de circuits imprimés haute fréquence, la rugosité de hauteur maximale (Rz) est inférieure ou égale à 2 µm pour la surface sur le côté couche diélectrique de la feuille de cuivre et, dans la région de la couche de surface sur le côté feuille de cuivre de la couche diélectrique, le rapport du nombre d'atomes inorganiques dans la charge inorganique par rapport au nombre d'atomes de fluor dans la résine fluorée est inférieur ou égal à 0,08.
(JA) 本開示に係る高周波プリント配線板用基材の第1の態様は、フッ素樹脂及び無機フィラーを含む誘電体層と、この誘電体層の少なくとも一方の面に積層される銅箔とを備える高周波プリント配線板用基材であって、上記銅箔の誘電体層側の面の最大高さ粗さ(Rz)が2μm以下であり、上記誘電体層の銅箔側の表層領域における上記フッ素樹脂のフッ素原子の原子数に対する上記無機フィラーの無機原子の原子数の比が0.08以下である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US20190215957