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1. (WO2019030994) CIRCUIT BOARD AND ELECTRONIC DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/030994 International Application No.: PCT/JP2018/017175
Publication Date: 14.02.2019 International Filing Date: 27.04.2018
IPC:
H01L 23/12 (2006.01) ,H01P 5/08 (2006.01) ,H05K 1/14 (2006.01) ,H01L 23/40 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
5
Coupling devices of the waveguide type
08
for linking lines or devices of different kinds
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
Applicants:
株式会社フジクラ FUJIKURA LTD. [JP/JP]; 東京都江東区木場1丁目5番1号 5-1, Kiba 1-chome, Koto-ku, Tokyo 1358512, JP
Inventors:
松丸 幸平 MATSUMARU Kohei; JP
Agent:
棚井 澄雄 TANAI Sumio; JP
五十嵐 光永 IGARASHI Koei; JP
小室 敏雄 KOMURO Toshio; JP
清水 雄一郎 SHIMIZU Yuichiro; JP
Priority Data:
2017-15566910.08.2017JP
Title (EN) CIRCUIT BOARD AND ELECTRONIC DEVICE
(FR) CARTE DE CIRCUIT IMPRIMÉ ET DISPOSITIF ÉLECTRONIQUE
(JA) 回路基板および電子装置
Abstract:
(EN) This circuit board comprises a first board, a second board, and an electronic element connected to the first board via a first connection section and connected to the second board via a second connection section. The thermal conductance of the second connection section is less than the thermal conductance of the first connection section.
(FR) Cette carte de circuit imprimé comprend une première carte, une seconde carte et un élément électronique connecté à la première carte par l'intermédiaire d'une première section de connexion et connecté à la seconde carte par l'intermédiaire d'une seconde section de connexion. La conductance thermique de la seconde section de connexion est inférieure à la conductance thermique de la première section de connexion.
(JA) 回路基板は、第1の基板と、第2の基板と、前記第1の基板と第1の接続部を介して接続され、前記第2の基板と第2の接続部を介して接続された電子素子と、を備え、前記第1の接続部の熱コンダクタンスよりも前記第2の接続部の熱コンダクタンスが小さい。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)