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1. (WO2019030891) FLEXIBLE DISPLAY DEVICE AND METHOD FOR MANUFACTURING FLEXIBLE DISPLAY DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/030891 International Application No.: PCT/JP2017/029077
Publication Date: 14.02.2019 International Filing Date: 10.08.2017
IPC:
G09F 9/30 (2006.01) ,G09F 9/00 (2006.01) ,H01L 27/32 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/02 (2006.01) ,H05B 33/06 (2006.01) ,H05B 33/22 (2006.01)
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
F
DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9
Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30
in which the desired character or characters are formed by combining individual elements
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
F
DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9
Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
06
Electrode terminals
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
22
characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
Applicants:
シャープ株式会社 SHARP KABUSHIKI KAISHA [JP/JP]; 大阪府堺市堺区匠町1番地 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522, JP
Inventors:
金子 誠二 KANEKO, Seiji; --
神崎 庸輔 KANZAKI, Yohsuke; --
斉藤 貴翁 SAITOH, Takao; --
山中 雅貴 YAMANAKA, Masaki; --
三輪 昌彦 MIWA, Masahiko; --
Agent:
特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK; 大阪府大阪市北区天神橋2丁目北2番6号 大和南森町ビル Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041, JP
Priority Data:
Title (EN) FLEXIBLE DISPLAY DEVICE AND METHOD FOR MANUFACTURING FLEXIBLE DISPLAY DEVICE
(FR) DISPOSITIF D'AFFICHAGE SOUPLE ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF D'AFFICHAGE SOUPLE
(JA) 可撓性表示装置及び可撓性表示装置の製造方法
Abstract:
(EN) A photo-sensitive PI layer (10) fills a bending area (BA) while being formed on a third insulating layer (9) in a display area (AA) and a terminal area (TA). An opening (10a) is formed in the photo-sensitive PI layer (10) and a contact hole (CH) is formed in a second insulating layer (7) and the third insulating layer (9) so that a gate electrode extending wire (6c) is exposed.
(FR) Une couche (10) de PI photosensible remplit une zone de flexion (BA) tout en étant formée sur une troisième couche isolante (9) dans une zone d'affichage (AA) et une zone de bornes (TA). Une ouverture (10a) est formée dans la couche (10) de PI photosensible et un trou de contact (CH) est formé dans une deuxième couche isolante (7) et la troisième couche isolante (9) de telle sorte qu'un fil (6c) d'extension d'électrode de grille soit exposé.
(JA) 感光性PI層(10)は、折り曲げ領域(BA)を埋めるとともに、表示領域(AA)及び端子領域(TA)において、第3絶縁層(9)上に形成されており、ゲート電極引き伸ばし配線(6c)が露出するように、感光性PI層(10)には開口(10a)が形成されており、第2絶縁層(7)及び第3絶縁層(9)にはコンタクトホール(CH)が形成されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)