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1. (WO2019030887) ELECTROOPTICAL DEVICE AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/030887 International Application No.: PCT/JP2017/029052
Publication Date: 14.02.2019 International Filing Date: 10.08.2017
IPC:
H05B 33/22 (2006.01) ,G09F 9/30 (2006.01) ,H01L 27/32 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/02 (2006.01) ,H05B 33/04 (2006.01) ,H05B 33/10 (2006.01) ,H05B 33/12 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
22
characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
F
DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9
Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30
in which the desired character or characters are formed by combining individual elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
04
Sealing arrangements
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
Applicants:
シャープ株式会社 SHARP KABUSHIKI KAISHA [JP/JP]; 大阪府堺市堺区匠町1番地 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522, JP
Inventors:
越智 久雄 OCHI, Hisao; --
妹尾 亨 SENOO, Tohru; --
高橋 純平 TAKAHASHI, Jumpei; --
平瀬 剛 HIRASE, Takeshi; --
園田 通 SONODA, Tohru; --
越智 貴志 OCHI, Takashi; --
松井 章宏 MATSUI, Akihiro; --
Agent:
特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK; 大阪府大阪市北区天神橋2丁目北2番6号 大和南森町ビル Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041, JP
Priority Data:
Title (EN) ELECTROOPTICAL DEVICE AND METHOD FOR MANUFACTURING SAME
(FR) DISPOSITIF ÉLECTRO-OPTIQUE ET SON PROCÉDÉ DE FABRICATION
(JA) 電気光学装置およびその製造方法
Abstract:
(EN) An electrooptical device (1) is provided with: a circuit board wherein a planarization layer (13) is provided on a surface; at least one electrooptical element that is provided on the planarization layer; a sealing film, which includes at least a resin layer, and which seals the electrooptical element; and a frame-shaped bank, which surrounds the planarization layer, and the inner side of which is covered with the resin layer. In a plan view, recesses and projections are provided at a peripheral end section of the planarization layer, said peripheral end section facing the frame-shaped bank.
(FR) La présente invention concerne un dispositif électro-optique comprenant : une carte de circuit imprimé dont une surface est pourvue d'une couche de planarisation (13) ; au moins un élément électro-optique disposé sur la couche de planarisation ; un film d'étanchéité qui comprend au moins une couche de résine et qui scelle l'élément électro-optique ; et un bloc en forme de cadre, qui entoure la couche de planarisation, et dont le côté intérieur est recouvert de la couche de résine. Dans une vue en plan, des évidements et des protubérances sont situés au niveau d'une section d'extrémité périphérique de la couche de planarisation, ladite section d'extrémité périphérique faisant face au bloc en forme de cadre.
(JA) 電気光学装置(1)は、表面に平坦化層(13)が設けられた回路基板と、上記平坦化層上に設けられた少なくとも1つの電気光学素子と、少なくとも樹脂層を含み、上記電気光学素子を封止する封止膜と、上記平坦化層を囲み、内側が上記樹脂層で覆われた枠状のバンクと、を備え、平面視で、上記枠状のバンクと対向する上記平坦化層の周端部に、凹凸が設けられている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)