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1. (WO2019030850) WIRING FORMING METHOD AND WIRING FORMING DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/030850 International Application No.: PCT/JP2017/028919
Publication Date: 14.02.2019 International Filing Date: 09.08.2017
IPC:
H05K 3/10 (2006.01) ,H05K 3/12 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12
using printing techniques to apply the conductive material
Applicants:
株式会社FUJI FUJI CORPORATION [JP/JP]; 愛知県知立市山町茶碓山19番地 19 Chausuyama, Yamamachi, Chiryu-shi, Aichi 4728686, JP
Inventors:
富永 亮二郎 TOMINAGA, Ryojiro; JP
牧原 克明 MAKIHARA, Katsuaki; JP
橋本 良崇 HASHIMOTO, Yoshitaka; JP
Agent:
特許業務法人ネクスト NEXT INTERNATIONAL; 愛知県名古屋市中区錦一丁目11番20号 大永ビルディング7階 7th Floor, Daiei Building, 11-20, Nishiki 1-chome, Naka-ku, Nagoya-shi, Aichi 4600003, JP
片岡 友希 KATAOKA, Tomoki; JP
Priority Data:
Title (EN) WIRING FORMING METHOD AND WIRING FORMING DEVICE
(FR) PROCÉDÉ ET DISPOSITIF DE FORMATION DE CÂBLAGE
(JA) 配線形成方法、および配線形成装置
Abstract:
(EN) This wiring forming method includes: an application step for applying, on an electrically insulative support or substrate, a metal-containing liquid that contains metal fine particles; and a firing treatment step for forming wiring by carrying out a firing treatment on the metal-containing liquid with a laser beam, wherein, in the application step, the metal-containing liquid is applied so that an application area ratio, which is the ratio of the application area size of the metal-containing liquid with respect to the area in the laser spot dimension of the laser beam, falls within a set range that has been set in advance.
(FR) La présente invention concerne un procédé de formation de câblage comprenant : une étape d'application consistant à appliquer, sur un substrat ou un support électriquement isolant, un liquide contenant du métal qui renferme des particules fines métalliques ; et une étape de traitement de cuisson consistant à former un câblage par réalisation d'un traitement de cuisson sur le liquide contenant du métal à l'aide d'un faisceau laser, dans l'étape d'application, le liquide contenant du métal étant appliqué de telle sorte qu'un rapport de zone d'application, qui est le rapport de la taille de la zone d'application du liquide contenant du métal par rapport à la zone dans la dimension de point laser du faisceau laser, se situe dans une plage donnée qui a été définie à l'avance.
(JA) 絶縁性の支持体または基板上に、金属微粒子を含有する金属含有液を塗布する塗布ステップと、金属含有液をレーザ光で焼成処理することで、配線を形成する焼成処理ステップとを含み、塗布ステップが、レーザ光のレーザスポット径内の面積に対する金属含有液の塗布面積の比率である塗布面積率が予め設定された範囲である設定範囲内となるように、金属含有液を塗布する配線形成方法。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)