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1. (WO2019030819) EL DEVICE PRODUCTION METHOD
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/030819 International Application No.: PCT/JP2017/028751
Publication Date: 14.02.2019 International Filing Date: 08.08.2017
IPC:
H05B 33/10 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/02 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
Applicants:
シャープ株式会社 SHARP KABUSHIKI KAISHA [JP/JP]; 大阪府堺市堺区匠町1番地 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522, JP
Inventors:
菅 勝行 SUGA, Katsuyuki; --
安田 有希 YASUDA, Yuki; --
Agent:
特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK; 大阪府大阪市北区天神橋2丁目北2番6号 大和南森町ビル Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041, JP
Priority Data:
Title (EN) EL DEVICE PRODUCTION METHOD
(FR) PROCÉDÉ DE PRODUCTION DE DISPOSITIF EL
(JA) ELデバイスの製造方法
Abstract:
(EN) An EL device (2) production method comprising the step of using emission of a laser (62) to detach a mother substrate (50) and a layered body (7) containing a light-emitting element layer (5) from one another, wherein the mother substrate (50) and the layered body (7) are in contact with one another via a resin layer (12) of the layered body (7), and the detachment by emission of the laser (60) onto the resin layer (12) is carried out such that emission on at least some of the edge sections of the resin layer (12) is carried out under different conditions from those for the center section of the resin layer (12).
(FR) La présente invention concerne un procédé de production de dispositif EL (2), comprenant l'étape consistant à utiliser l'émission d'un laser (62) de façon à détacher un substrat mère (50) et un corps stratifié (7) comprenant une couche d'élément électroluminescent (5), le substrat mère (50) et le corps stratifié (7) étant en contact l'un avec l'autre par le biais d'une couche de résine (12) du corps stratifié (7), et le détachement par émission du laser (60) sur la couche de résine (12) étant réalisé de telle sorte que l'émission sur au moins une partie des sections de bord de la couche de résine (12) est menée dans des conditions différentes de celles concernant la section centrale de la couche de résine (12).
(JA) マザー基板(50)と、発光素子層(5)を含む積層体(7)とを、レーザー(62)を照射して剥離する工程を含むELデバイス(2)の製造方法であって、マザー基板(50)と積層体(7)とは、積層体(7)の樹脂層(12)を介して接しており、樹脂層(12)にレーザー(60)を照射して剥離をする際、樹脂層(12)の端部の少なくとも一部に対して、樹脂層(12)の中央部とは異なる条件で、照射を行う。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)