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1. (WO2019030520) METHOD FOR LASER MACHINING INSIDE MATERIALS
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/030520 International Application No.: PCT/GB2018/052256
Publication Date: 14.02.2019 International Filing Date: 07.08.2018
IPC:
B23K 26/53 (2014.01) ,B23K 26/03 (2006.01) ,B28D 5/00 (2006.01) ,B23K 26/064 (2014.01)
[IPC code unknown for B23K 26/53]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
03
Observing the workpiece
B PERFORMING OPERATIONS; TRANSPORTING
28
WORKING CEMENT, CLAY, OR STONE
D
WORKING STONE OR STONE-LIKE MATERIALS
5
Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
[IPC code unknown for B23K 26/064]
Applicants:
OXFORD UNIVERSITY INNOVATION LIMITED [GB/GB]; Buxton Court 3 West Way Oxford Oxfordshire OX2 0JB, GB
Inventors:
BOOTH, Martin James; GB
SALTER, Patrick; GB
Agent:
HALL, Matthew; GB
Priority Data:
1712639.207.08.2017GB
Title (EN) METHOD FOR LASER MACHINING INSIDE MATERIALS
(FR) PROCÉDÉ D'USINAGE AU LASER DE L'INTÉRIEUR DE MATÉRIAUX
Abstract:
(EN) The invention provides a method for laser modification of a sample to form a modified region at a target location within the sample. The method comprises positioning a sample in a laser system for modification by a laser; measuring tilt of a surface of the sample through which the laser focusses; using at least the measured tilt to determine a correction to be applied to an active optical element of the laser system; applying the correction to the active optical element to modify wavefront properties of the laser to counteract an effect of coma on laser focus; and laser modifying the sample at the target location using the laser with the corrected wavefront properties to produce the modified region.
(FR) L'invention concerne un procédé destiné à modifier par laser un échantillon en vue de former une région modifiée au niveau d'un emplacement cible au sein de l'échantillon. Le procédé comprend le positionnement, dans un système laser, d'un échantillon destiné à être modifié par un laser ; la mesure de l'inclinaison d'une surface de l'échantillon à travers laquelle le laser se focalise ; l'utilisation d'au moins l'inclinaison mesurée en vue de déterminer une correction à appliquer à un élément optique actif du système laser ; l'application de la correction à l'élément optique actif en vue de modifier des propriétés de front d'onde du laser en vue de contrebalancer un effet de coma sur la focalisation laser ; et la modification par laser de l'échantillon au niveau de l'emplacement cible en utilisant le laser dont les propriétés de front d'onde ont été corrigées en vue de produire la région modifiée.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)