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1. (WO2019029765) POSITION-TOLERANCE-INSENSITIVE CONTACTING MODULE FOR CONTACTING OPTOELECTRONIC CHIPS
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/029765 International Application No.: PCT/DE2018/100642
Publication Date: 14.02.2019 International Filing Date: 13.07.2018
IPC:
G01R 31/28 (2006.01) ,G01R 31/311 (2006.01) ,G02B 6/43 (2006.01) ,H04B 10/80 (2013.01)
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28
Testing of electronic circuits, e.g. by signal tracer
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28
Testing of electronic circuits, e.g. by signal tracer
302
Contactless testing
308
using non-ionising electromagnetic radiation, e.g. optical radiation
311
of integrated circuits
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24
Coupling light guides
42
Coupling light guides with opto-electronic elements
43
Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
B
TRANSMISSION
10
Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
80
Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03-H04B10/70166
Applicants:
JENOPTIK OPTICAL SYSTEMS GMBH [DE/DE]; Göschwitzer Strasse 25 07745 Jena, DE
Inventors:
GNAUSCH, Tobias; DE
BÜTTNER, Robert; DE
KADEN, Thomas; DE
JUHASZ, Thomas; DE
GRUNDMANN, Armin; DE
VON FREYHOLD, Thilo; DE
Agent:
SCHALLER, Renate; DE
FREITAG, Joachim; DE
OEHMKE, Volker; DE
Priority Data:
10 2017 008 618.411.09.2017DE
10 2017 010 066.724.10.2017DE
10 2017 117 839.207.08.2017DE
10 2018 002 032.108.03.2018DE
Title (DE) LAGETOLERANZUNEMPFINDLICHES KONTAKTIERUNGSMODUL ZUR KONTAKTIERUNG OPTOELEKTRONISCHER CHIPS
(EN) POSITION-TOLERANCE-INSENSITIVE CONTACTING MODULE FOR CONTACTING OPTOELECTRONIC CHIPS
(FR) MODULE DE CONTACT INSENSIBLE À LA TOLÉRANCE DE POSITION DESTINÉ AU CONTACT DE PUCES OPTOÉLECTRONIQUES
Abstract:
(DE) Die Erfindung betrifft ein Kontaktierungsmodul (1), mittels dem die individuellen elektrischen und optischen Ein- und Ausgänge (AoC) von optoelektronischen Chips (2) mit den gerätespezifischen elektrischen und optischen Ein- und Ausgängen einer Testapparatur verbunden werden. Es zeichnet sich durch eine vergleichsweise hohe Justierinsensibilität der optischen Kontakte zwischen den Chips (2) und dem Kontaktierungsmodul (1) aus, die z. B. durch technische Maßnahmen erreicht wird, die dazu führen, dass die optischen Eingänge (ΕoK) des Chips (2) oder am Kontaktierungsmodul (1) in jeder möglichen Justierlage von dem jeweils einzukoppelnden optischen Signal (So) überstrahlt werden.
(EN) The invention relates to a contacting module (1) by means of which the individual electrical and optical inputs and outputs (AoC) of optoelectronic chips (2) are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. Said contacting module is characterised by a comparatively high alignment insensitivity of the optical contacts between the chips (2) and the contacting module (1), which is achieved e.g. by technical measures which have the effect that the optical inputs (ΕoK) of the chip (2) or at the contacting module (1) in every possible alignment position are swamped by the respective optical signal (So) to be coupled in.
(FR) L'invention concerne un module de contact (1) au moyen duquel les entrées et sorties (AoC) électriques et optiques individuelles de puces optoélectroniques (2) sont connectées aux entrées et sorties électriques et optiques spécifiques à l'appareil d'un appareil d'essai. Il se caractérise par une insensibilité comparativement élevée d'ajustement des contacts optiques entre les puces (2) et le module de contact (1) qui peut être atteinte par ex. par des mesures techniques qui conduisent à ce que les entrées (ΕoK) de la puce (2) ou au niveau du module de contact (1) sont irradiées dans chaque position d'ajustement possible par le signal optique (So) qui doit être respectivement couplé à elles.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)