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1. (WO2019029602) SEMICONDUCTOR MANUFACTURING APPARATUS
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/029602 International Application No.: PCT/CN2018/099545
Publication Date: 14.02.2019 International Filing Date: 09.08.2018
IPC:
H01L 21/67 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Applicants:
上海微电子装备(集团)股份有限公司 SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD. [CN/CN]; 中国上海市 张江高科技园区张东路1525号 1525 Zhangdong Road, Zhangjiang High-Tech Park Shanghai 201203, CN
Inventors:
陈飞彪 CHEN, Feibiao; CN
郭耸 GUO, Song; CN
Agent:
上海思微知识产权代理事务所(普通合伙) SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY; 中国上海市 黄浦区复兴中路1号申能国际大厦606-607室 Units 606-607, Shenergy International Building 1 Middle Fuxing Road, Huangpu District Shanghai 200021, CN
Priority Data:
201710682504.X10.08.2017CN
Title (EN) SEMICONDUCTOR MANUFACTURING APPARATUS
(FR) APPAREIL DE FABRICATION DE SEMI-CONDUCTEURS
(ZH) 半导体制造装置
Abstract:
(EN) Provided is a semiconductor manufacturing apparatus, comprising: a chip supply module, used for providing a plurality of chips; a load plate supply module, comprising a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module, comprising a chip transfer-loading platform used for suctioning a plurality of chips; said chip transfer-loading platform is used, at a first position, for transferring a plurality of chips from the chip supply module; the chip transfer-loading platform carries the plurality of chips to a second position so as to bond the plurality of chips onto a load plate to form a bonding sheet; and a packaging module, used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.
(FR) L'invention concerne un appareil de fabrication de semi-conducteurs, comprenant : un module d'alimentation en puces, utilisé pour fournir une pluralité de puces; un module d'alimentation en plaques de chargement, comprenant une plaque de chargement et une plateforme de déplacement de plaque de chargement utilisée pour tenir la plaque de chargement; un module de transfert-chargement de puces, comprenant une plateforme de transfert-chargement de puces utilisée pour aspirer une pluralité de puces, ladite plateforme de transfert-chargement de puces étant utilisée, dans une première position, pour transférer une pluralité de puces à partir du module d'alimentation en puces, la plateforme de transfert-chargement de puces transportant la pluralité de puces jusqu'à une seconde position de façon à coller la pluralité de puces sur une plaque de chargement afin de former une feuille de collage; et un module d'encapsulation, utilisé pour encapsuler la plaque de collage sur la plate-forme de déplacement de plaque de chargement afin de former une puce encapsulée.
(ZH) 一种半导体制造装置,包括:芯片供应模块,用于提供多个芯片;载板供应模块,包括载板和用于承载载板的载板运动台;芯片转载模块,包括用于吸附多个芯片的芯片转载台,其中芯片转载台用于在第一位置处从芯片供应模块上交接多个芯片,芯片转载台承载多个芯片至第二位置,以将多个芯片键合至载板上形成键合片;以及封装模块,用于对载板运动台上的键合片进行封装,以形成封装芯片。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)