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1. (WO2019029121) PHOTOVOLTAIC ASSEMBLY
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/029121 International Application No.: PCT/CN2018/070076
Publication Date: 14.02.2019 International Filing Date: 03.01.2018
IPC:
H01L 31/048 (2014.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
04
adapted as conversion devices
042
including a panel or array of photoelectric cells, e.g. solar cells
048
encapsulated or with housing
Applicants:
苏州赛伍应用技术股份有限公司 CYBRID TECHNOLOGIES INC. [CN/CN]; 中国江苏省苏州市 吴江经济技术开发区叶港路369号 No. 369, Yegang Road, Wujiang Economic and Technological Development Zone Suzhou, Jiangsu 215200, CN
Inventors:
戴建方 DAI, Jianfang; CN
李新军 LI, Xinjun; CN
尤迁 YOU, Qian; CN
陈洪野 CHEN, Hongye; CN
吴小平 WU, Xiaoping; CN
Agent:
北京品源专利代理有限公司 BEYOND ATTORNEYS AT LAW; 中国北京市 海淀区莲花池东路39号西金大厦6层 F6, Xijin Centre 39 Lianhuachi East Rd., Haidian District Beijing 100036, CN
Priority Data:
201710679321.210.08.2017CN
Title (EN) PHOTOVOLTAIC ASSEMBLY
(FR) ENSEMBLE PHOTOVOLTAÏQUE
(ZH) 光伏组件
Abstract:
(EN) A photovoltaic assembly, comprising: a transparent front plate (1), a first encapsulation layer (2), a solar cell sheet (3), a second encapsulation layer (4) and a back plate (5) which are successively stacked; the back plate (5) comprises a first substrate layer (50), a cellular core layer (51) and a second substrate layer (52) which are successively stacked; the bonding between the first substrate layer (50) and the cellular core layer (51) and between the second substrate layer (53) and the cellular core layer (51) are achieved by means of an adhesive respectively; the first substrate layer (50) is located between the second encapsulation layer (4) and the cellular core layer (51), and the first substrate layer (50) is a resin insulating layer or a metal layer.
(FR) L'invention concerne un ensemble photovoltaïque, comprenant : une plaque avant transparente (1), une première couche d'encapsulation (2), une feuille de cellule solaire (3), une seconde couche d'encapsulation (4) et une plaque arrière (5) qui sont empilées successivement; la plaque arrière (5) comprend une première couche de substrat (50), une couche de noyau cellulaire (51) et une seconde couche de substrat (52) qui sont empilées successivement; les liaisons entre la première couche de substrat (50) et la couche centrale cellulaire (51) et entre la seconde couche de substrat (53) et la couche centrale cellulaire (51) sont obtenues au moyen d'un adhésif respectivement; la première couche de substrat (50) est située entre la seconde couche d'encapsulation (4) et la couche centrale cellulaire (51), et la première couche de substrat (50) est une couche isolante en résine ou une couche métallique.
(ZH) 一种光伏组件,包括:依次层叠设置的透明前板(1)、第一封装层(2)、太阳能电池片(3)、第二封装层(4)及背板(5),所述背板(5)包括依次层叠设置的第一基板层(50)、蜂窝芯层(51)和第二基板层(52),所述第一基板层(50)和蜂窝芯层(51)之间、第二基板层(52)和蜂窝芯层(51)之间分别通过胶粘剂粘接,所述第一基板层(50)位于所述第二封装层(4)和蜂窝芯层(51)之间,所述第一基板层(50)为树脂绝缘层或金属层。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)