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1. (WO2019028254) METHOD AND SYSTEM FOR MOVING A SUBSTRATE
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Pub. No.: WO/2019/028254 International Application No.: PCT/US2018/045010
Publication Date: 07.02.2019 International Filing Date: 02.08.2018
IPC:
H01L 21/67 (2006.01) ,H01L 21/68 (2006.01) ,H01L 21/687 (2006.01) ,H01L 21/66 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68
for positioning, orientation or alignment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
687
using mechanical means, e.g. chucks, clamps or pinches
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
Applicants:
APPLIED MATERIALS ISRAEL LTD. [IL/IL]; 9 Oppenheimer Street 76705 Rehovot, IL
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors:
ADAN, Ofer; IL
AVNERI, Israel; IL
UZIEL, Yoram; IL
KRIVTS (KRAYVITZ), Igor; IL
KHASGIWALE, Niranjan Ramchandra; US
Agent:
CATMULL, Kelvin B.; US
Priority Data:
15/668,51703.08.2017US
Title (EN) METHOD AND SYSTEM FOR MOVING A SUBSTRATE
(FR) PROCÉDÉ ET SYSTÈME POUR DÉPLACER UN SUBSTRAT
Abstract:
(EN) A method and a system for moving a substrate, the system includes a chamber, a chuck, a movement system that is positioned outside the chamber, a controller, an intermediate element, at least one sealing element that is configured to form a dynamic seal between the intermediate element and the chamber housing. The movement system is configured to repeat, for each region of the substrate out of a plurality of regions of the substrate, the steps of: rotating the chuck to position a given portion of the region of the substrate within a field of view that is related to an opening of the chamber housing; and moving the chuck relation to the opening to position additional portions of the region of the substrate within the field of view that is related to the opening.
(FR) L'invention concerne un procédé et un système pour déplacer un substrat, le système comprenant une chambre, un mandrin, un système de déplacement qui est positionné à l'extérieur de la chambre, un dispositif de commande, un élément intermédiaire, au moins un élément d'étanchéité qui est conçu pour former un joint d'étanchéité dynamique entre l'élément intermédiaire et le boîtier de chambre. Le système de mouvement est configuré pour répéter, pour chaque région du substrat sur une pluralité de régions du substrat, les étapes consistant à : faire tourner le mandrin pour positionner une partie donnée de la région du substrat dans un champ de vision qui est associé à une ouverture du boîtier de chambre ; et à déplacer la relation de mandrin par rapport à l'ouverture pour positionner des parties supplémentaires de la région du substrat dans le champ de vision qui est associé à l'ouverture.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)