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1. (WO2019028017) METHOD FOR DETECTING VOIDS AND AN INSPECTION SYSTEM
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Pub. No.: WO/2019/028017 International Application No.: PCT/US2018/044596
Publication Date: 07.02.2019 International Filing Date: 31.07.2018
IPC:
H01L 21/66 (2006.01) ,G01Q 90/00 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
G PHYSICS
01
MEASURING; TESTING
Q
SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING-PROBE MICROSCOPY [SPM]
90
Scanning-probe techniques or apparatus not otherwise provided for
Applicants:
APPLIED MATERIALS ISRAEL LTD. [IL/IL]; 9 Oppenheimer Street 76705 Rehovot, IL
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors:
SHEMESH, Dror; IL
KUCHIK, Vadim; IL
BREIL, Nicolas L.; US
Agent:
CATMULL, Kelvin, B.; US
Priority Data:
62/539,79901.08.2017US
62/626,84706.02.2018US
Title (EN) METHOD FOR DETECTING VOIDS AND AN INSPECTION SYSTEM
(FR) PROCÉDÉ DE DÉTECTION DE VIDES ET SYSTÈME D'INSPECTION
Abstract:
(EN) A method for detecting voids in a metal line of a semiconductor device die includes: scanning an electron beam upon a selected location on the die containing the metal line; determine gray levels in an image produced by collected electrons of the electron beam backscattered from the selected location on the die; and identifying one or more voids in the metal line based on differences between the gray levels in the image.
(FR) L'invention concerne un procédé de détection de vides dans une ligne métallique d'une puce de dispositif à semi-conducteur consistant à : balayer un faisceau d'électrons sur un emplacement sélectionné sur la puce contenant la ligne métallique; déterminer des niveaux de gris dans une image produite par des électrons collectés du faisceau d'électrons rétrodiffusé à partir de l'emplacement sélectionné sur la puce; et identifier un ou plusieurs vides dans la ligne métallique sur la base de différences entre les niveaux de gris de l'image.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)