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1. (WO2019027908) SILICONE RESIN, RELATED METHODS, AND FILM FORMED THEREWITH
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Pub. No.: WO/2019/027908 International Application No.: PCT/US2018/044393
Publication Date: 07.02.2019 International Filing Date: 30.07.2018
IPC:
C09D 183/14 (2006.01) ,C08G 77/48 (2006.01) ,H01L 21/02 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
183
Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
14
in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
77
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
48
in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
Applicants:
DOW SILICONES CORPORATION [US/US]; 2200 West Salzburg Road Auburn, Michigan 48686-0994, US
Inventors:
SCHMIDT, Randall; US
WEI, Yanhu; US
XU, Shengqing; US
Agent:
PECK, Randall J.; US
BALLOR, Nicholas R.; US
BECKER, Rebecca A.; US
BONDARENKO, Gregory P.; US
BURPEE, Charles E.; US
CIARAVINO, Vito A.; US
COLLINS, Catherine S.; US
DANI, William P.; US
DEVRIES, Nathan J.; US
GOSKA, Matthew L.; US
HARRIER, Ian M.; US
ISTVAN-MITCHELL, Wyatt J.; US
KLEINHEKSEL, Chad E.; US
SHUNTA, Dustin H.; US
Priority Data:
62/539,02931.07.2017US
Title (EN) SILICONE RESIN, RELATED METHODS, AND FILM FORMED THEREWITH
(FR) RÉSINE DE SILICONE, PROCÉDÉS ASSOCIÉS ET FILM FORMÉ PAR CEUX-CI
Abstract:
(EN) A silicone resin is disclosed. The silicone resin is free from carbon atoms. A method of preparing the resin is additionally disclosed. This method comprises reacting a silane compound and a precursor compound, thereby preparing the silicone resin. A composition including the silicon resin and a vehicle is further disclosed. A method of preparing a film with the composition is also disclosed. This method comprises applying the composition including the silicone resin and the vehicle to a substrate to form a layer. This method also includes heating the layer to give the film.
(FR) L'invention concerne une résine de silicone. La résine de silicone est exempte d'atomes de carbone. La présente invention concerne également un procédé de préparation de la résine. Ce procédé comprend la réaction d'un composé de type silane et d'un composé précurseur, ce qui permet de préparer la résine de silicone. L'invention concerne en outre une composition comprenant la résine de silicone et un véhicule. La présente invention concerne également un procédé de préparation d'un film à l'aide de la composition. Ce procédé comprend l'application de la composition comprenant la résine de silicone et le véhicule sur un substrat pour former une couche. Ce procédé comprend également le chauffage de la couche pour obtenir le film.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)