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1. (WO2019027823) DIE ADDRESSING
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Pub. No.: WO/2019/027823 International Application No.: PCT/US2018/044036
Publication Date: 07.02.2019 International Filing Date: 27.07.2018
IPC:
G06F 12/02 (2006.01) ,G06F 12/1009 (2016.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
12
Accessing, addressing or allocating within memory systems or architectures
02
Addressing or allocation; Relocation
[IPC code unknown for G06F 12/1009]
Applicants:
MICRON TECHNOLOGY, INC. [US/US]; Mail Stop 525 8000 South Federal Way P.O. Box 6 Boise, Idaho 83707-0006, US
Inventors:
HASWELL, Jonathan M.; US
Agent:
GALLUS, Nathan J.; US
Priority Data:
15/664,35231.07.2017US
Title (EN) DIE ADDRESSING
(FR) ADRESSAGE DE PUCES
Abstract:
(EN) An example apparatus for die addressing can include an array of memory cells and a memory cache. The memory cache can be configured to store at least a portion of an address mapping table. The address mapping table can include entries that map translation units (TUs) to physical locations in the array. The entries can include data that indicate a location within the array that stores a particular TU without including data that indicates which die of the array the TU is stored in.
(FR) Un exemple d'appareil d'adressage de puces peut comprendre une matrice de cellules de mémoire et une mémoire cache. La mémoire cache peut être configurée de manière à stocker au moins une partie d'une table de mise en correspondance d'adresses. La table de mise en correspondance d'adresses peut contenir des entrées qui mettent en correspondance des unités de traduction (TU) et des positions physiques dans la matrice. Les entrées peuvent contenir des données qui indiquent une position dans la matrice qui stocke une TU particulière sans contenir de données qui indiquent dans quelle puce de la matrice la TU est stockée.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)