Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019027699) ELECTRONICS PACKAGE INCLUDING INTEGRATED STRUCTURE WITH BACKSIDE FUNCTIONALITY AND METHOD OF MANUFACTURING THEREOF
Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

CLAIMS

What is claimed is:

1. An electronics package comprising:

a support substrate;

an electrical component having an active surface coupled to a first surface of the support substrate;

an insulating structure coupled to the first surface of the support substrate and at least one sidewall of the electrical component;

a functional layer comprising at least one functional component formed on at least one of a sloped sidewall of the insulating structure and a backside surface of the electrical component; and a first wiring layer formed on a second surface of the support substrate, the first wiring layer electrically coupled to the functional layer through at least one via in the support substrate.

2. The electronics package of claim 1 wherein the at least one functional component comprises one of a sensor, a passive component, an antenna, an integrated device, and an identification tag.

3. The electronics package of claim 1 wherein the active surface of the electrical component has at least one contact pad positioned thereon; and

wherein the first wiring layer extends through at least another via in the support substrate to electrically couple with the at least one contact pad.

4. The electronics package of claim 1 wherein the functional layer further comprises at least one conductive trace; and

wherein the at least one conductive trace extends over the sloped sidewall of the insulating structure and electrically couples the at least one functional component to the first wiring layer.

5. The electronics package of claim 1 wherein the functional layer further comprises at least one non-conductive communication line.

6. The electronics package of claim 1 further comprising an insulating material surrounding the electrical component, the insulating structure, and the functional layer.

7. The electronics package of claim 6 further comprising a second wiring layer electrically coupled to the first wiring layer by at least one electrical connection formed through a thickness of the electronics package; and

wherein the first wiring layer forms a first input/output connection on a first side of the electronics package the second wiring layer forms a second input/output connection on a second side of the electronics package.

8. An electronics package comprising:

a first support substrate;

an electrical component having an active surface coupled to a first surface of the first support substrate, the active surface comprising at least one contact pad;

an insulating structure with at least one sloped side wall formed adjacent the electrical component and coupled to the first support substrate;

a functional layer comprising:

at least one component formed on at least one of a backside surface of the electrical component and the at least one sloped sidewall of the insulating structure; and

at least connection line formed on the at least one sloped side wall of the insulating structure and electrically coupled to the at least one component; and

a first conductive layer extending through the first support substrate to couple with the at least one connection line.

9. The electronics package of claim 8 wherein the at least one component comprises at least one of an integral thin film component, a discrete passive component, and an integrated component.

10. The electronics package of claim 8 wherein the at least one component comprises at least one of a passive component, a sensor component, an antenna, a MEMS component, a SAW device, and an identification tag.

11. The electronics package of claim 8 further comprising:

a second support substrate;

an insulating material located between the first and second support substrates and surrounding the insulating structure and the electrical component; and

a second conductive layer extending through the second support substrate to couple with the functional layer.

12. The electronics package of claim 8 wherein the first conductive layer further comprises:

a first portion electrically coupled to at least one contact pad of the electrical component through at least a first via formed in the first support substrate; and

a second portion electrically coupled to the functional layer through at least a second via formed in the first support substrate.

13. The electronics package of claim 8 wherein the functional layer comprises:

at least a first component and a second component; and

at least one connection line electrically coupling the first component to the second component.

14. The electronics package of claim 8 wherein a first portion of the functional layer is formed on the first surface of the first support structure;

wherein a second portion of the functional layer is formed on the backside surface of the electrical component; and

wherein a third portion of the functional layer is formed on the insulating structure.

15. A method of forming an electronics package comprising;

bonding an active surface of an electronic component to a first surface of a support substrate;

encapsulating at least a portion of the electronic component in a resin material;

forming a functional layer on at least one of a surface of the resin material and a backside surface of the electronic component, the functional layer comprising at least one functional component;

forming vias through the support substrate; and

forming a wiring layer on a second surface of the support substrate and into the vias to electrically connect to the functional layer.

16. The method of claim 15 wherein forming the functional layer comprises forming one of a sensor, a passive component, an antenna, an integrated device, and an identification tag.

17. The method of claim 15 further comprising forming the wiring layer to extend though at least another via in the support substrate to electrically couple with at least one contact pad located on the active surface of the electronic component.

18. The method of claim 15 wherein forming the functional layer further comprises forming at least one conductor on a surface of the resin material, the at least one conductor electrically coupling the at least one functional component to the wiring layer.

19. The method of claim 15 further comprising surrounding the electrical component, the resin material, and the functional layer in an insulating material.

20. The method of claim 15 further comprising forming a second wiring layer on the outer surface of the resin material, the second wiring layer coupled to the wiring layer by at least one electrical connection formed through a thickness of the electronics package.

21. The method of claim 15 further comprising bonding the electronic component to the support substrate with a resin material disposed on one of a surface of the electronic component and the first surface of the support substrate.

22. The method of claim 15 further comprising forming the functional layer by one or more of direct dispense, subtractive processing, semi-additive processing, and component placement.

23. The method of claim 15 wherein the forming vias through the support substrate comprises one or more of laser drilling, mechanical drilling, plasma etching, and chemical etching.

24. The method of claim 15 comprising forming the wiring layer on the second surface of the support substrate and into the vias by depositing and patterning a metal layer by one or more of sputtering, evaporation, electroless plating, and electro-plating.

25. The method of claim 15 further comprising forming a conductor on the second surface of the electronic component.

26. The method of claim 15 wherein encapsulating at least a portion of the electronic component in the resin material further comprises disposing a resin material around the electronic component and curing the resin material.

27. The method of claim 15 further comprising mounting a support structure on the first surface of the support substrate, the support substrate having an opening sized to accommodate the electronic component.