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1. (WO2019027675) PATTERNED BONDED GLASS LAYERS IN ELECTRONIC DEVICES
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Pub. No.: WO/2019/027675 International Application No.: PCT/US2018/042646
Publication Date: 07.02.2019 International Filing Date: 18.07.2018
IPC:
C03C 17/22 (2006.01) ,C03C 27/10 (2006.01) ,H04M 1/00 (2006.01)
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
17
Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating
22
with other inorganic material
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
27
Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
06
Joining glass to glass by processes other than fusing
10
with the aid of adhesive specially adapted for that purpose
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
M
TELEPHONIC COMMUNICATION
1
Substation equipment, e.g. for use by subscribers
Applicants:
APPLE INC. [US/US]; One Apple Park Way Cupertino, CA 95014, US
Inventors:
WILSON, James R.; US
ROGERS, Matthew S.; US
Agent:
TREYZ, George Victor; US
Priority Data:
15/967,38330.04.2018US
62/539,45431.07.2017US
Title (EN) PATTERNED BONDED GLASS LAYERS IN ELECTRONIC DEVICES
(FR) COUCHES DE VERRE LIÉES À MOTIFS DANS DES DISPOSITIFS ÉLECTRONIQUES
Abstract:
(EN) An electronic device may include electrical components and other components mounted within an interior of a housing. The device may have a display on a front face of the device and may have a glass layer that forms a housing wall on a rear face of the device. The glass housing wall may be provided with regions having different appearances. The regions may be textured, may have coatings such as thin-film interference filter coatings formed from stacks of dielectric material having alternating indices of refraction, may have metal coating layers, and/or may have ink coating layers. Textured surfaces, cavities, coatings, and other decoration may be embedded in glass structures that are joined with chemical bonds at diffusion-bonding interfaces.
(FR) L'invention concerne un dispositif électronique qui peut comprendre des composants électriques et d'autres composants montés à l'intérieur d'un boîtier. Le dispositif peut avoir un dispositif d'affichage sur une face avant du dispositif et peut avoir une couche de verre qui forme une paroi de boîtier sur une face arrière du dispositif. La paroi de boîtier en verre peut être pourvue de régions ayant différents aspects. Les régions peuvent être texturées, peuvent avoir des revêtements, tels que des revêtements de filtre interférentiel à film mince formés à partir d'empilements de matériau diélectrique ayant des indices de réfraction alternés, peuvent avoir des couches de revêtement métallique, et/ou peuvent avoir des couches de revêtement d'encre. Des surfaces texturées, des cavités, des revêtements et d'autres décorations peuvent être incorporés dans des structures en verre qui sont assemblées avec des liaisons chimiques au niveau d'interfaces de liaison par diffusion.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)