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1. (WO2019027519) FILM CUTTING DEVICE HAVING A LINEAR ACTUATOR
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Pub. No.: WO/2019/027519 International Application No.: PCT/US2018/030253
Publication Date: 07.02.2019 International Filing Date: 30.04.2018
IPC:
B26D 1/04 (2006.01) ,B26D 7/02 (2006.01) ,B26D 7/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
D
CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
1
Cutting through work characterised by the nature or movement of the cutting member; Apparatus or machines therefor; Cutting members therefor
01
involving a cutting member which does not travel with the work
04
having a linearly-movable cutting member
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
D
CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
7
Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
01
Means for holding or positioning work
02
with clamping means
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
D
CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
7
Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
Applicants:
DOW GLOBAL TECHNOLOGIES LLC [US/US]; 2040 Dow Center Midland, MI 48674, US
Inventors:
MCCARTY II, Donald, L.; US
GEE, William, E.; US
DOTSON, Larry; US
OCONNELL, Paul; US
ZIEMAN, Jonathan, J.; US
LUND, John; US
Agent:
SCHWARZ, Steven, J.; US
Priority Data:
62/539,25231.07.2017US
Title (EN) FILM CUTTING DEVICE HAVING A LINEAR ACTUATOR
(FR) DISPOSITIF DE COUPE DE FILM AYANT UN ACTIONNEUR LINÉAIRE
Abstract:
(EN) A method for cutting a film of material and a cutting device for cutting the film of material are described herein. The cutting device includes a film support plate, and a pressure plate configured to move relative to the film support plate to hold the film of material on the film support plate. The device further includes one or more blades, and a linear actuator configured to move the one or more blades relative to the film support plate to cut the film of material held on the film support plate.
(FR) L'invention concerne un procédé de coupe d'un film de matériau et un dispositif de coupe pour couper le film de matériau. Le dispositif de coupe comprend une plaque de support de film, et une plaque de pression conçue pour se déplacer par rapport à la plaque de support de film pour maintenir le film de matériau sur la plaque de support de film. Le dispositif comprend en outre une ou plusieurs lames, et un actionneur linéaire conçu pour déplacer la ou les lames par rapport à la plaque de support de film pour couper le film de matériau maintenu sur la plaque de support de film.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)